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W83194R-58A Schematic ( PDF Datasheet ) - Winbond

Teilenummer W83194R-58A
Beschreibung 100MHZ AGP CLOCK FOR VIA CHIPSET
Hersteller Winbond
Logo Winbond Logo 




Gesamt 13 Seiten
W83194R-58A Datasheet, Funktion
W83194R-58A
100MHZ AGP CLOCK FOR VIA CHIPSET
1.0 GENERAL DESCRIPTION
The W83194R-58A is a Clock Synthesizer for VIA chipset. W83194R-58A provides all clocks
required for high-speed RISC or CISC microprocessor such as Intel PentiumII and also provides 16
different frequencies of CPU clocks by software setting. AGP and PCI clocks are externally
selectable with smooth transitions. The W83194R-58A provides AGP clocks especially for clone
chipset, and makes SDRAM in synchronous frequency with CPU or AGP clocks.
The W83194R-58A provides I2C serial bus interface to program the registers to enable or disable
each clock outputs and choose the 0.25%, 0.5% or 0.5%,1.5% center type spread spectrum to reduce
EMI.
The W83194R-58A accepts a 14.318 MHz reference crystal as its input and runs on a 3.3V supply.
High drive PCI and SDRAM CLOCK outputs typically provide greater than 1 V /ns slew rate into 30
pF loads. CPU CLOCK outputs typically provide better than 1 V /ns slew rate into 20 pF loads when
maintaining 50± 5% duty cycle. The fixed frequency outputs as REF, 24MHz, and 48 MHz provide
better than 0.5V /ns slew rate.
2.0 PRODUCT FEATURES
Supports Pentium, PentiumPro, PentiumII, AMD and Cyrix CPUs with I2C.
4 CPU clocks
12 SDRAM clocks for 3 DIMs
Two AGP clocks
6 PCI synchronous clocks.
Optional single or mixed supply:
(Vdd = Vddq3 = Vddq2 = Vddq2b = 3.3V) or (Vdd = Vddq3 = Vddq2 = 3.3V, Vdq2b = 2.5V)
Skew form CPU to PCI clock -1 to 4 ns, center 2.6 ns, AGP to CPU sync. skew 0 ns (250 ps)
SDRAM frequency synchronous to CPU or AGP clocks
Smooth frequency switch with selections from 60 to 100 MHz CPU(-37) and 66 to 150MHz(-58)
I2C 2-Wire serial interface and I2C read back
0~0.5% down type and 0.25%, 0.5% center type spread spectrum to reduce EMI
Programmable registers to enable/stop each output and select modes
(mode as Tri-state or Normal )
MODE pin for power Management
48 MHz for USB
24 MHz for super I/O
48-pin SSOP package
Publication Release Date: Nov. 1999
- 1 - Revision 0.30






W83194R-58A Datasheet, Funktion
W83194R-58A
5.5 Power Pins
SYMBOL
Vdd
Vddq2
Vddq2b
Vddq3
Vss
PRELIMINARY
PIN
1
42
48
6,14,19, 30, 36
3,9,16,22,27,
33,39,45
FUNCTION
Power supply for Ref [0:1] crystal and core logic.
Power supply for AGP1 and REF1 output, either 2.5V or
3.3V.
Power supply for CPUCLK[0:3], either 2.5V or 3.3V.
Power supply for SDRAM, PCICLK and 48/24MHz
outputs.
Circuit Ground.
6.0 FREQUENCY SELECTION BY HARDWARE
6.2 W83194R-58 Frequency Selection Table
FS2 FS1 FS0
00 0
00 1
010
01 1
10 0
10 1
11 0
11 1
CPU(MHz)
112
66.8
97.0
75
133.3
83.3
95.25
100.2
SDRAM
SD_SEL=1
112
66.8
97.0
75
133.3
83.3
95.25
100.2
(MHz)
SD_SEL=0
74.7
66.8
64.67
75
88.7
66.6
63.5
66.8
PCI (MHz)
37.3
33.4
32.33
37.5
44.3
33.3
31.75
33.4
AGP (MHz)
74.7
66.8
64.67
75
88.7
66.6
63.5
66.8
REF (MHz)
14.318
14.318
14.318
14.318
14.318
14.318
14.318
14.318
7.0 CPU 3.3#_2.5 BUFFER SELECTION
CPU 3.3#_2.5 ( Pin 2 ) Input Level
1
0
CPU Operate at
VDD = 2.5V
VDD = 3.3V
Publication Release Date: Nov. 1999
- 6 - Revision 0.30

6 Page









W83194R-58A pdf, datenblatt
11.0 PACKAGE DRAWING AND DIMENSIONS
W83194R-58A
PRELIMINARY
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
- 12 -
Publication Release Date: Nov. 1999
Revision 0.30

12 Page





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