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ULN2003AP Schematic ( PDF Datasheet ) - Toshiba Semiconductor

Teilenummer ULN2003AP
Beschreibung 7CH DARLINGTON SINK DRIVER
Hersteller Toshiba Semiconductor
Logo Toshiba Semiconductor Logo 




Gesamt 13 Seiten
ULN2003AP Datasheet, Funktion
ULN2003,04AP/AFW
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
ULN2003AP,ULN2003AFW,ULN2004AP,ULN2004AFW
(Manufactured by Toshiba Malaysia)
7ch Darlington Sink Driver
The ULN2003AP/AFW Series are highvoltage, highcurrent
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
Features
Output current (single output): 500 mA (max)
High sustaining voltage output: 50 V (min)
Output clamp diodes
Inputs compatible with various types of logic
Package Type-AP: DIP-16pin
Package Type-AFW: SOL-16pin
Type
ULN2003AP/AFW
ULN2004AP/AFW
Input Base
Resistor
2.7 k
10.5 k
Designation
TTL, 5 V CMOS
6~15 V PMOS, CMOS
Pin Connection (top view)
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
SOL16-P-150-1.27A: 0.15 g (typ.)
1 2006-06-14






ULN2003AP Datasheet, Funktion
8. tON, tOFF
ULN2003,04AP/AFW
Note 1: Pulse width 50 µs, duty cycle 10%
Output impedance 50 , tr 5 ns, tf 10 ns
Note 2: See below
Input Condition
Type Number
R1
ULN2003AP/AFW
ULN2004AP/AFW
0
0
Note 3: CL includes probe and jig capacitance.
VIH
3V
8V
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to shortcircuit between outputs, air contamination fault, or fault by improper grounding.
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6 Page









ULN2003AP pdf, datenblatt
ULN2003,04AP/AFW
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
12 2006-06-14

12 Page





SeitenGesamt 13 Seiten
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