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TZA1027HL Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer TZA1027HL
Beschreibung Analog current buffer for CD-R and CD-RW systems
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 16 Seiten
TZA1027HL Datasheet, Funktion
INTEGRATED CIRCUITS
DATA SHEET
TZA1027
Analog current buffer for CD-R and
CD-RW systems
Preliminary specification
File under Integrated Circuits, IC01
1999 Sep 17






TZA1027HL Datasheet, Funktion
Philips Semiconductors
Analog current buffer for CD-R and CD-RW
systems
Preliminary specification
TZA1027
FUNCTIONAL DESCRIPTION
All detector signals are applied to wide-band amplifiers for servo and laser power calibration functions of the TZA1020.
Signals from the central detector are added and amplified to suitable levels for the decoder circuit. Current gain can be
selected for CD-R and CD-RW discs.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDD
Tstg
Tamb
Ves
supply voltage
storage temperature
ambient temperature
electrostatic handling:
Machine model
Human body model
PARAMETERS
MIN.
0
6.5
0
MAX.
5.5
+150
70
UNIT
V
°C
°C
100
500
+100
+500
V
V
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
thermal resistance from junction to
ambient
CONDITION
in free air
VALUE
95
UNIT
K/W
LOGIC FUNCTIONS
PDWN
1
0
0
0
0
Note
1. X = don’t care.
WRON
X; note 1
0
0
1
1
HG
X; note 1
0
1
0
1
MODE
power-down
CD-R read
CD-RW read
CD-R write
CD-RW write
1999 Sep 17
6

6 Page









TZA1027HL pdf, datenblatt
Philips Semiconductors
Analog current buffer for CD-R and CD-RW
systems
Preliminary specification
TZA1027
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A
mildly-activated flux will eliminate the need for removal of
corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 17
12

12 Page





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