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X20C04EM Schematic ( PDF Datasheet ) - Xicor

Teilenummer X20C04EM
Beschreibung Nonvolatile Static RAM
Hersteller Xicor
Logo Xicor Logo 




Gesamt 15 Seiten
X20C04EM Datasheet, Funktion
X20C04
4K
X20C04
Nonvolatile Static RAM
512 x 8 Bit
FEATURES
High Reliability
—Endurance: 1,000,000 Nonvolatile Store
Operations
—Retention: 100 Years Minimum
Power-on Recall
—E2PROM Data Automatically Recalled Into
SRAM Upon Power-up
Lock Out Inadvertent Store Operations
Low Power CMOS
—Standby: 250µA
Infinite E2PROM Array Recall, and RAM Read
and Write Cycles
Compatible with X2004
DESCRIPTION
The Xicor X20C04 is a 512 x 8 NOVRAM featuring a
static RAM overlaid bit-for-bit with a nonvolatile electri-
cally erasable PROM (E2PROM). The X20C04 is fabri-
cated with advanced CMOS floating gate technology to
achieve low power and wide power-supply margin. The
X20C04 features the JEDEC approved pinout for byte-
wide memories, compatible with industry standard RAMs,
ROMs, EPROMs, and E2PROMs.
The NOVRAM design allows data to be easily trans-
ferred from RAM to E2PROM (store) and E2PROM to
RAM (recall). The store operation is completed in 5ms or
less and the recall operation is completed in 5µs or less.
Xicor NOVRAMS are designed for unlimited write
operations to RAM, either from the host or recalls from
E2PROM, and a minimum 1,000,000 store operations to
the E2PROM. Data retention is specified to be greater
than 100 years.
PIN CONFIGURATION
PLASTIC
CERDIP
NE
NC
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
VSS
1 28
2 27
3 26
4 25
5 24
6 23
7 22
8 X20C04 21
9 20
10 19
11 18
12 17
13 16
14 15
VCC
WE
NC
A8
NC
NC
OE
NC
CE
I/O7
I/O6
I/O5
I/O4
I/O3
3825 FHD F02
LCC
PLCC
4 3 2 1 32 31 30
A6 5
29 A8
A5 6
28 NC
A4 7
27 NC
A3 8
A2 9
X20C04
(TOP VIEW)
26 NC
25 OE
A1 10
24 NC
A0 11
23 CE
NC 12
22 I/O7
I/O0 13
21 I/O6
14 15 16 17 18 19 20
3825 FHD F03
©Xicor, Inc. 1992, 1995, 1996 Patents Pending
3825-2.8 7/31/97 T4/C0/D0 SH
1 Characteristics subject to change without notice






X20C04EM Datasheet, Funktion
X20C04
A.C. CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified)
Read Cycle Limits
Symbol
Parameter
X20C04-15 X20C04-20 X20C04-25 X20C04
Min. Max. Min. Max. Min. Max. Min. Max. Units
tRC
tCE
tAA
tOE
tLZ(3)
tOLZ(3)
tHZ(3)
tOHZ(3)
tOH
Read Cycle Time
Chip Enable Access Time
Address Access Time
Output Enable Access Time
Chip Enable to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z
Output Disable to Output in High Z
Output Hold From Address Change
Read Cycle
150 200 250 300
ns
150 200 250 300 ns
150 200 250 300 ns
50 70 100 150 ns
0 0 0 0 ns
0 0 0 0 ns
80 100 100 100 ns
80 100 100 100 ns
0 0 0 0 ns
3825 PGM T10
ADDRESS
CE
OE
VIH
WE
DATA I/O
tRC
tCE
tOE
tOLZ
tLZ
DATA VALID
tOH
tAA
tHZ
DATA VALID
tOHZ
3825 FHD F05
Note: (3) tLZ min., tHZ, tOLZ min., and tOHZ are periodically sampled and not 100% tested. tHZ max. and tOHZ max. are measured, with
CL = 5pF from the point when CE or OE return HIGH (whichever occurs first) to the time when the outptus are no longer driven.
6

6 Page









X20C04EM pdf, datenblatt
X20C04
PACKAGING INFORMATION
28-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P
1.470 (37.34)
1.400 (35.56)
PIN 1 INDEX
PIN 1
1.300 (33.02)
REF.
0.557 (14.15)
0.510 (12.95)
0.085 (2.16)
0.040 (1.02)
SEATING
PLANE
0.160 (4.06)
0.120 (3.05)
0.110 (2.79)
0.090 (2.29)
0.065 (1.65)
0.040 (1.02)
0.625 (15.88)
0.590 (14.99)
0.160 (4.06)
0.125 (3.17)
0.030 (0.76)
0.015 (0.38)
0.022 (0.56)
0.014 (0.36)
TYP. 0.010 (0.25)
0°
15°
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
3926 FHD F04
12

12 Page





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