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PDF MPXH6250AC6U Data sheet ( Hoja de datos )
| Número de pieza | MPXH6250AC6U | |
| Descripción | HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR | |
| Fabricantes | Motorola Inc | |
| Logotipo |  |
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MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPXH6250A
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
Motorola’s MPXH6250A series sensor integrates on–chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature compensation.
The small form factor and high reliability of on–chip integration make the Motorola pressure
sensor a logical and economical choice for the system designer.
The MPXH6250A series piezoresistive transducer is a state–of–the–art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
Features
• Improved Accuracy at High Temperature
• Available in Small and Super Small Outline Packages
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Temperature Compensated from –40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
Application Examples
• Industrial Controls
• Engine Control/Manifold Absolute Pressure (MAP)
VS
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
Vout
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor
Schematic
MPXH6250A
SERIES
INTEGRATED
PRESSURE SENSOR
20 to 250 kPa (3.0 to 36 psi)
0.3 to 4.9 Volts Output
SUPER SMALL OUTLINE
PACKAGE
MPXH6250A6T1
CASE 1317
MPXH6250AC6T1
CASE 1317A
PIN NUMBER
1 N/C 5 N/C
2 VS 6 N/C
3 Gnd 7 N/C
4 Vout 8 N/C
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is denoted by the
chamfered corner of the package.
REV 0
Motorola Sensor
Motorola, Inc. 2003
Device
Data
For More Information On This Product,
Go to: www.freescale.com
MPXH6250A SERIES
1
1 page  
Freescale Semiconductor, Inc.
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self–align when subjected to
a solder reflow process. It is always recommended to fabri-
cate boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.150
3.81
0.050
1.27
TYP
0.387
9.83
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
Motorola Sensor Device Data For More Information On This Product,
Go to: www.freescale.com
MPXH6250A SERIES
5
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| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MPXH6250AC6U.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MPXH6250AC6T1 | HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR | Motorola Inc |
| MPXH6250AC6U | HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR | Motorola Inc |
| MPXH6250AC6U | HIGH TEMPERATURE ACCURACY INTEGRATED SILICON PRESSURE SENSOR | Motorola Inc |
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