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236 Schematic ( PDF Datasheet ) - Wakefield Thermal Solutions

Teilenummer 236
Beschreibung Board Level Power Semiconductor Heat Sinks
Hersteller Wakefield Thermal Solutions
Logo Wakefield Thermal Solutions Logo 




Gesamt 7 Seiten
236 Datasheet, Funktion
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PATENT 361317
216 SERIES Surface Mount Heat Sinks
D2PAK, TO-220, SOL-20
Standard
P/N
216-40CT
216-40CTT
216-40CTR
Height Above
PC Board
.390 in. (9.9)
.390 in. (9.9)
.390 in. (9.9)
Footprint Dimensions
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
25
250
Thermal Performance at Typical Load
Natural Convection Forced Convection
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of
high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder
reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path
from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk,
tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.
MECHANICAL DIMENSIONS
.740
(18.8)
216-40CT
.600
(15.2)
.640
(16.3)
.600
(15.2)
.020
(0.5)
.215
(5.5) .215
(5.5)
.600
(15.2)
.020
(0.5)
216-40CTT
NOTES:
1. ESD MATERIAL WITH PLUGS
2. LENGTH OF TUBE: 16.25 INCHES
3. QUANTITY PER TUBE: 25 PIECES
TUBE DETAILS
.390 .265
(9.9) .640 (6.7)
(16.3)
.470
(11.9)
.840
(21.3)
.350
(8.9)
.025
(0.6)
216-40CTR
A
TAPE
DETAILS
USE MAX
COPPER
TO ALLOW
MAX
CONDUCTION
TO HEAT SINK
RECOMMENDED COPPER FOOTPRINT
.660
(16.8)
.640
(16.3)
.660
(16.8)
.060
(1.5)
6 LAYER BOARD, D2PAK
125°C LEAD, 40°C AMBIENT
AIR VELOCITY (LFM)
7 0 100 200 300 400 500
6
.626
(15.9)
A
.768
(19.5)
.390
(9.9)
REEL
DETAILS
.945
(24.0)
SECTION
A-A
COPPER FOOTPRINT
FOR HEAT SINK
.640
(16.3)
5
4
1.260
(32.0)
13.000
(330.2)
MIN COPPER
FOR HEAT
3
SINK
2
.390 REF:
(9.9)
JEDEC TO-263 D2PAK
JEDEC TO-220AB
1
JEDEC TO-261AA
.409
.215
(5.5)
JEDEC MO-184
JEDEC MS-013
JEDEC MS-025
(10.4)
NATURAL CONVECTION
6 LAYER BOARD, D2PAK
125°C LEAD, 40°C AMBIENT
THERMAL PERFORMANCE
DATA
POWER, W
100
30 0
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
NO HEAT SINK
6 LAYER BOARD, D2PAK
AIR VELOCITY (LFM)
100 200 300 400 500
25
80
1.28
(32.5)
60
40
20
15
10
20
NOTES:
1. ESD MATERIAL
2. EIA STANDARD, EIA-481-3
3. LENGTH OF REEL: APPROXIMATELY 6 METERS
4. QUANTITY PER REEL: 250 PIECES
0
HS, 2 IN. BOARD
HS, 4 IN. BOARD
NO HS, 2 IN. BOARD
NO HS, 4 IN. BOARD
0
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
Dimensions: in. (mm)
PATENT PENDING
230 and 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
TO-220
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Height Above
PC Board
.750 in. (19.1)
.750 in. (19.1)
.500 in. (12.7)
.875 in. (22.2)
.790 in. (20.0)
.790 in. (20.0)
.500 in. (12.7)
Footprint Dimensions
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.750 in. (19.1) x .570 in. (14.5)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.790 in. (20.0) x .570 in. (14.5)
Mounting
Configuration
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz.
Vertical
Horizontal
Solderable
Tab Option
No Tab
01
05
10
No Tab
01
05
Mounting Thermal Performance at Typical Load
Style Natural Convection Forced Convection
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures
uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating
the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used
interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10
to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.500
(12.7)
.570 MAX
(14.5)
230-75AB-01
.500
(12.7)
230-75AB
.500
(12.7)
234-75AB
.750
(19.1)
.050
(1.3)
.570 MAX
(14.5)
.250
(6.4)
.500
(12.7)
230 AND 234 SERIES
230-75AB-10
.125
(3.2)
.063
(1.6)
234-75AB-01
.375 .020 TAB 10
(9.5) (0.5)
.032 TAB 01
(0.8)
.090
(2.3) 234-75AB-05
.720 .790
(18.3) (20.1)
.540
(13.7)
Dimensions: in. (mm)
.720 .790
(18.3) (20.1)
.032 .050
(0.8) (1.3)
.210
(5.3) .430
(10.9)
.032
(0.8)
.165
(4.2)
.570 MAX
(14.5)
230
and
234
SERIES
.500 MIN
(12.7)
.050
(1.3)
2x.100
(2.5)
230-75AB-05
.750
(19.1)
.032
(0.8) .165
(4.2)
234 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
.370
(9.4)
2x.125
(3.2)
.500
(12.7)
230 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100010
80
230/234
8
60 6
40
230/234
20
4
2
0
01
23
0
45
POWER DISSIPATION (WATTS)
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
2
Refer to Full Line Catalog for additional
Board-Level Heat Sinks and
Thermal Accessory Products






236 Datasheet, Funktion
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips
Multiwatt
Standard
P/N
250-122AB
250-122AB-09
250-122AB-25
Height Above
PC Board
1.220 in. (31.0)
1.220 in. (31.0)
1.380 in. (35.1)
Mounting
Footprint Dimensions Configuration
1.000 in. (25.4) x .500 in. (12.7) Vert./Horiz.
1.000 in. (25.4) x .500 in. (12.7) Vertical
1.000 in. (25.4) x .500 in. (12.7) Vertical
Solderable
Tab Option
No Tab
09
25
Mounting
Style
Clip
Clip
Clip
Thermal Performance at Typical Load
Natural Convection Forced Convection
50°C @ 4W 3.7°C/W @ 400 LFM
50°C @ 4W 3.7°C/W @ 400 LFM
50°C @ 4W 3.7°C/W @ 400 LFM
Slim profile heat sinks with integral self-locking clips occupy minimum board real estate and reduce assembly costs. Their integral locking features
eliminate mounting hardware typically needed for component installation and removal yet provide rapid and secure device-to-heat-sink surface
contact and retention. The 250 Series is ideal for a variety of high-power dissipation Multiwatt component applications. Specify solderable tab
options by the addition of suffix 09 or 25 to the standard part number (i.e. 250-122AB-09 or 250-122AB-25). Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.500
(12.7)
1.00
(25.4)
1.22 REF
(31.0)
250-122AB
1.00
(25.4)
1.22
(31.0)
250 SERIES
250-122AB-09
.500
(12.7)
250-122AB-09
SUGGESTED TAB HOLE=
Ø.100 (2.5) (PLATED)
WITH Ø.125 (3.2) PAD
250-122AB-25
SUGGESTED TAB HOLE=
Ø.075 (1.9) (PLATED)
WITH Ø.100 (2.5) PAD
.200
(5.1)
250-122AB-25
.160 .310
(4.1) (7.9)
.950
(24.1)
.032 (TAB 09)
(0.8)
.020 (TAB 25)
(0.5)
Dimensions: in. (mm)
.075
(1.9)
.275
(7.0)
.275
(7.0)
.062
(1.6)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100010
80 8
60 6
40 4
20 2
0
02
46
0
8 10
POWER DISSIPATION (WATTS)
237 and 252 SERIES High-Performance, High-Power Vertical Mount Heat Sinks
TO-220
Standard
P/N
237-167AB2
237-167AB3
237-167AB2-24
252-167AB2
252-167AB3
252-167AB2-24
Height Above
PC Board
1.675 in. (42.5)
1.675 in. (42.5)
1.675 in. (42.5)
1.675 in. (42.5)
1.675 in. (42.5)
1.675 in. (42.5)
Mounting Tab Options
Footprint Dimensions Configuration Type
1.000 in. (25.4) x 1.000 in. (25.4) Vertical
2, Twisted
1.000 in. (25.4) x 1.000 in. (25.4) Vertical
3, Twisted
1.000 in. (25.4) x 1.000 in. (25.4) Vertical 2, Solderable
1.000 in. (25.4) x 1.000 in. (25.4) Vertical
2, Twisted
1.000 in. (25.4) x 1.000 in. (25.4) Vertical
3, Twisted
1.000 in. (25.4) x 1.000 in. (25.4) Vertical 2, Solderable
Mounting Thermal Performance at Typical Load
Style Natural Convection Forced Convection
Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM
Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM
Clip/Mtg Slot 46°C @ 4W 4.5°C/W @ 200 LFM
Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM
Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM
Clip/Mtg Slot 40°C @ 4W 4.5°C/W @ 200 LFM
High-performance heat sinks for TO-220 devices mounted vertically. Three bottom fins of the 237 series are recessed to allow closer component
mounting. Models are available with two twist and three twist mount tabs or two solderable tabs. Specify solderable tab options by the addition
of suffix 24 to the standard part number (i.e. 237-167AB-24 or 252-167AB-24). Order SpeedClips™ 285SC or 330SC separately for rapid
component installation, lowering manufacturing costs. Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
237 AND 252 SERIES
237-167
1.000
(25.4)
252-167
1.000
(25.4)
237-167AB2
252-167AB2
237-167AB2-24
252-167AB2-24 .200
(5.1)
.375 x .156
(9.5) (4.0)
.400 REF
(10.2)
.100 TYP
(2.5)
1.000
(25.4)
1.675
(42.5)
.700
(17.8)
TAB AVAILABLE ON
237-167AB3 ONLY
(3 TABS TWISTED)
.500
(12.7)
.450
(11.4)
.450
(11.4)
.100 TYP.
(2.5)
2 TABS
(TWISTED)
TAB AVAILABLE ON
252-167AB3 ONLY
(3 TABS TWISTED)
TAB HOLES
.375
(9.5)
.032 REF
(0.8)
.950
(24.1)
2 TABS
(SOLDERABLE)
3 TABS (TWISTED)
237-167AB3
252-167AB3 ONLY
237 AND 252 SERIES
.475 (12.1)
.950 (24.1)
ø.130
(3.3)
Order SpeedClips™
Separately
Stainless Steel 330SC 4#
Spring Steel 285SC 10#
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100010
80 8
60 6
237
252
40 4
237
20 2
252
0
01
23
0
45
POWER DISSIPATION (WATTS)
Dimensions: in. (mm)
626 and 627 SERIES High-Efficiency Heat Sinks for Vertical Board Mounting
TO-218, TO-220
Standard
P/N
626-10ABP
626-15ABP
626-20ABP
626-25ABP
Standard
P/N
627-10ABP
627-15ABP
627-20ABP
627-25ABP
Height Above
PC Board “A”
1.000 in. (25.4)
1.500 in. (38.1)
2.000 in. (50.8)
2.500 in. (63.5)
Maximum Footprint
1.375 in. (34.9) x .500 in. (12.7)
1.375 in. (34.9) x .500 in. (12.7)
1.375 in. (34.9) x .500 in. (12.7)
1.375 in. (34.9) x .500 in. (12.7)
Thermal Performance at Typical Load
Natural Convection
Forced Convection
76°C @ 6W
5.8°C/W @ 200 LFM
65°C @ 6W
5.5°C/W @ 200 LFM
55°C @ 6W
4.7°C/W @ 200 LFM
48°C @ 6W
4.2°C/W @ 200 LFM
Wave-solderable pins on 1 in. (25.4) centers for vertical mounting. Maximum semiconductor package width is .660 in. (16.8). Models have .125 in.
(3.2) “Notch” for PC board traces below the heat sink base and a mounting hole positioned for either TO-218 or TO-220 components. Thermal
accessory products including thermal compounds, adhesives, interface materials, and others are available.
MECHANICAL DIMENSIONS
.500
(12.7)
1.375
(34.9)
D REF
.063
(1.6)
Dimensions: in. (mm)
Series
626
627
Type Device
TO-218
TO-220
Hole Diameter “B”
.144 (3.7)
.128 (3.3)
626 AND 627 SERIES
A
.125
.156 (TYP-2)
(4.0)
(3.2)
1.000 REF
E (25.4)
BC
Hole Height “C”
.850 (21.6)
.720 (18.3)
Webb Width “D”
.660 (16.8)
.625 (15.9)
.093 DIA
(2.4)
Notch Width “E”
.540 (13.7)
.437 (11.1)
Extrusion Profile
8420
5183
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 10005
80 4
60
40
626/627-25ABP
20
626/627-10ABP
626/627-25ABP
3
2
1
00
0 4 8 12 16 20
POWER DISSIPATION (WATTS)
Refer to Full Line Catalog for additional
Board-Level Heat Sinks and
Thermal Accessory Products
Wakefield Engineering, Inc.
7 60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874

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