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74AHC1GU04 Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer 74AHC1GU04
Beschreibung Inverter
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 16 Seiten
74AHC1GU04 Datasheet, Funktion
INTEGRATED CIRCUITS
DATA SHEET
74AHC1GU04
Inverter
Product specification
File under Integrated Circuits, IC06
1999 May 19






74AHC1GU04 Datasheet, Funktion
Philips Semiconductors
Inverter
Product specification
74AHC1GU04
AC CHARACTERISTICS
Type 74AHC1GU04
GND = 0 V; tr = tf 3.0 ns.
TEST CONDITIONS
Tamb (°C)
SYMBOL PARAMETER
WAVEFORMS
tPHL/tPLH
tPHL/tPLH
tPHL/tPLH
tPHL/tPLH
propagation delay
inA to outY
propagation delay
inA to outY
propagation delay
inA to outY
propagation delay
inA to outY
see Figs 5 and 6
see Figs 5 and 6
see Figs 5 and 6
see Figs 5 and 6
CL
15 pF
VCC (V)
3.0 to 3.6
+25
MIN. TYP.
3.4(1)
MAX.
7.1
40 to +85
MIN. MAX.
1.0 8.5
UNIT
ns
50 pF 3.0 to 3.6 4.9(1) 10.6 1.0 12.0 ns
15 pF 4.5 to 5.5 2.6(2) 5.5 1.0 6.0 ns
50 pF 4.5 to 5.5 3.6(2) 7.0 1.0 8.0 ns
Notes
1. Typical values at VCC = 3.3 V.
2. Typical values at VCC = 5.0 V.
AC WAVEFORMS
handbook, halfpage
inA INPUT
outY OUTPUT
VM(1)
tPHL
VM(1)
tPLH
MNA046
handbook, halfpage
PULSE
GENERATOR
VI
VCC
D.U.T.
RT
VO
CL 50 pF
MNA034
(1) VM = 50%; VI = GND to VCC.
Fig.5 The input (inA) to output (outY) propagation
delays.
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance. (See
Chapter “AC characteristics” for values).
RT = Termination resistance should be equal to the output
impedance ZO of the pulse generator.
Fig.6 Load circuitry for switching times.
1999 May 19
6

6 Page









74AHC1GU04 pdf, datenblatt
Philips Semiconductors
Inverter
Product specification
74AHC1GU04
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, SQFP
HLQFP, HSQFP, HSOP, SMS
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
WAVE
not suitable
not suitable(2)
suitable
not recommended(3)(4)
not recommended(5)
SOLDERING METHOD
REFLOW(1)
suitable
suitable
suitable
suitable
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 May 19
12

12 Page





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