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FIN1027AM Schematic ( PDF Datasheet ) - Fairchild Semiconductor

Teilenummer FIN1027AM
Beschreibung 3.3V LVDS 2-Bit High Speed Differential Driver
Hersteller Fairchild Semiconductor
Logo Fairchild Semiconductor Logo 




Gesamt 12 Seiten
FIN1027AM Datasheet, Funktion
April 2001
Revised June 2003
FIN1027 FIN1027A
3.3V LVDS 2-Bit High Speed Differential Driver
General Description
This dual driver is designed for high speed interconnects
utilizing Low Voltage Differential Signaling (LVDS) technol-
ogy. The driver translates LVTTL signal levels to LVDS lev-
els with a typical differential output swing of 350 mV which
provides low EMI at ultra low power dissipation even at
high frequencies. This device is ideal for high speed trans-
fer of clock or data.
The FIN1027 or FIN1027A can be paired with its compan-
ion receiver, the FIN1028, or with any other LVDS receiver.
Features
s Greater than 600Mbs data rate
s 3.3V power supply operation
s 0.5ns maximum differential pulse skew
s 1.5ns maximum propagation delay
s Low power dissipation
s Power-Off protection
s Meets or exceeds the TIA/EIA-644 LVDS standard
s Flow-through pinout simplifies PCB layout
s 8-Lead SOIC, US8, and 8-terminal MLP
packages save space
Ordering Code:
Order Number
FIN1027M
FIN1027MX
FIN1027K8X
FIN1027MPX
(Preliminary)
FIN1027AM
FIN1027AMX
Package Number
Package Description
M08A
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
[TUBE]
M08A
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
[TAPE and REEL]
MAB08A
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
[TAPE and REEL]
MLP08C
8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square
[TAPE and REEL]
M08A
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
[TUBE]
M08A
8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
[TAPE and REEL]
© 2003 Fairchild Semiconductor Corporation DS500501
www.fairchildsemi.com






FIN1027AM Datasheet, Funktion
DC / AC Typical Performance Curves (Continued)
FIGURE 10. Power Supply Current vs.
Frequency
FIGURE 11. Power Supply Current vs.
Power Supply Voltage
FIGURE 12. Power Supply Current vs.
Ambient Temperature
FIGURE 13. Differential Propagation Delay vs.
Power Supply
FIGURE 14. Differential Propagation Delay vs.
Ambient Temperature
FIGURE 15. Differential Skew (tPLH - tPHL) vs.
Power Supply
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FIN1027AM pdf, datenblatt
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square
Package Number MLP08C
(Preliminary)
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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