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CWR06DC155J Schematic ( PDF Datasheet ) - Vishay Siliconix

Teilenummer CWR06DC155J
Beschreibung Solid Tantalum Chip Capacitors MIDGET Military/ MIL-PRF-55365/4 Qualified
Hersteller Vishay Siliconix
Logo Vishay Siliconix Logo 




Gesamt 7 Seiten
CWR06DC155J Datasheet, Funktion
CWR06
Solid Tantalum Chip Capacitors
Vishay Sprague
MIDGET® Military, MIL-PRF-55365/4 Qualified
FEATURES
Weibull Failure Rates B, C; Exponential M, P, R, S.
Tape and Reel available per EIA 481-1 and-2.
Termination finishes available; Gold Plate, 50µ inch
minimum (standard), Solder Plated Hot Solder Dipped.
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55°C to + 85°C. (To + 125°C
with voltage derating.)
Capacitance Range: 0.10µF-100µF
ORDERING INFORMATION
CWR06
D
TYPE VOLTAGE
B
TERMINATION
FINISH
155
CAPACITANCE
Capacitance Tolerance: ± 10%, ± 20% standard. ± 5%
available as special.
Voltage Rating: 4WVDC to 50WVDC.
K
CAPACITANCE
TOLERANCE
B
FAILURE RATE
%/1000 HOURS
OPTIONAL
SURGE CURRENT
OPTIONS
C= 4 V
D= 6 V
F = 10V
H = 15 V
J = 20 V
K = 25 V
M= 35 V
N = 50 V
B = Gold. Standard.
H = Solder Plate.
C = Solder Dipped
This is expressed
in picofarads. The
first two digits are
the significant
figures. The third
is the number of
zeros to follow.
K = ± 10%
M = ± 20%
J = ± 5%
A = Commercial
M = 1.0
P = 0.1
R = 0.01
S = 0.001
B = 0.1
C = 0.01
A = 10 Cycles at
+ 25°C
B = 10 Cycles at
-55°C and
+ 85°C.
C = 10 Cycles at
-55°C and
+ 85°C
(Before Weibull
Grading).
DIMENSIONS in inches [millimeters]
-+
Weld and
W Dimple
Projection
Identifies
L
Anode (+)
Terminal
-+
W
L
T1 H
T1
P P T2 Max.
PP
CASE
CODE
L
W
H P T1
A
0.100 ± 0.015
0.050 ± 0.015
0.050 ± 0.015
0.030 ± 0.005
0.005
[2.54 ± 0.38]
[1.27 ± 0.38]
[1.27 ± 0.38]
[0.76 ± 0.13]
[0.13]
B
0.150 ± 0.015
0.050 ± 0.015
0.050 ± 0.015
0.030 ± 0.005
0.005
[3.81 ± 0.38]
[1.27 ± 0.38]
[1.27 ± 0.38]
[0.76 ± 0.13]
[0.13]
C
0.200 ± 0.015
0.050 ± 0.015
0.050 ± 0.015
0.030 ± 0.005
0.005
[5.08 ± 0.38]
[1.27 ± 0.38]
[1.27 ± 0.38]
[0.76 ± 0.13]
[0.13]
D
0.150 ± 0.015
0.100 ± 0.015
0.050 ± 0.015
0.030 ± 0.005
0.005
[3.81 ± 0.38]
[2.54 ± 0.38]
[1.27 ± 0.38]
[0.76 ± 0.13]
[0.13]
E
0.200 ± 0.015
0.100 ± 0.015
0.050 ± 0.015
0.030 ± 0.005
0.005
[5.08 ± 0.38]
[2.54 ± 0.38]
[1.27 ± 0.38]
[0.76 ± 0.13]
[0.13]
F
0.220 ± 0.015
0.135 ± 0.015
0.070 ± 0.015
0.030 ± 0.005
0.005
[5.59 ± 0.38]
[3.43 ± 0.38]
[1.78 ± 0.38]
[0.76 ± 0.13]
[0.13]
G
0.265 ± 0.015
0.110 ± 0.015
0.110 ± 0.015
0.050 ± 0.005
0.005
[6.73 ± 0.38]
[2.79 ± 0.38]
[2.79 ± 0.38]
[1.27 ± 0.13]
[0.13]
H
0.285 ± 0.015
0.150 ± 0.015
0.110 ± 0.015
0.050 ± 0.005
0.005
[7.24 ± 0.38]
[3.81 ± 0.38]
[2.79 ± 0.38]
[1.27 ± 0.13]
[0.13]
Note: When solder coated terminations are required, add .015" [0.38mm] to termination dimension tolerances.
H
T2 Max.
T2 (Max.)
0.015
[0.38]
0.015
[0.38]
0.015
[0.38]
0.015
[0.38]
0.015
[0.38]
0.015
[0.38]
0.015
[0.38]
0.015
[0.38]
Document Number 40009
Revision 16-Nov-04
For technical questions, contact [email protected]
www.vishay.com
133






CWR06DC155J Datasheet, Funktion
CWR06
Vishay Sprague
GUIDE TO APPLICATION (Continued)
Case Code
A
B
C
D
E
F
G
H
Maximum Permissible
Power Dissipation
@ + 25°C (Watts) in free air
0.060
0.075
0.075
0.085
0.095
0.110
0.120
0.150
6. Printed Circuit Board Materials: The CWR06 is
compatible with commonly used printed circuit board
materials (alumina substrates, FR4, FR5, G10, PTFE-
fluorocarbon and porcelainized steel). If you desire
other board materials, contact the factory for
availability.
7. Attachment:
7.1 Solder Paste: The recommended thickness of the
solder paste after application is .007" ± .001"
[.178mm ± .025mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous state
of the solder.
7.2 Soldering: Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate methods.
The Soldering Profile chart shows maximum
recomended time/temperature conditions for solder-
ing. Attachment with a soldering iron is not recom-
mended due to the difficulty of controlling temperature
and time at temperature.
8. Cleaning (Flux Removal) After Soldering: The
CWR06 is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene
and aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents
containing methylene chloride or other epoxy solvents
should be avoided since these attack the epoxy
encapsulation material.
9 Recommended Mounting Pad Geometries: The
area under the tantalum wire nib should not be
metallized on the PC board. The width dimension
indicated is the same as the maximum width of the
capacitor. This is to minimize lateral movement.
REFLOW SOLDER PADS*
in inches [millimetres]
A
B CB
CASE
CODE
A
B
C
D
E
F
G
H
WIDTH
(A)
0.65
(1.6)
0.065
(1.6)
0.065
(1.6)
0.115
(2.9)
0.115
(2.9)
0.150
(3.8)
0.125
(3.2)
0.165
(4.2)
PAD
METALIZATION SEPARATION
(B) (C)
0.050
(1.3)
0.040
(1.0)
0.070
(1.8)
0.055
(1.4)
0.070
(1.8)
0.120
(0.3)
0.070
(1.8)
0.070
(1.8)
0.070
(1.8)
0.120
(3.0)
0.070
(1.8)
0.140
(3.6)
0.070
(1.8)
0.170
(4.3)
0.090
(2.3)
0.170
(4.3)
RECOMMENDED REFLOW SOLDERING PROFILE
250
200
150
100
50
0
50
100 150 200 250
TIME (SECONDS)
300 350
www.vishay.com
138
For technical questions, contact [email protected]
Document Number 40009
Revision 16-Nov-04

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