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HS-2420RH Schematic ( PDF Datasheet ) - Intersil Corporation

Teilenummer HS-2420RH
Beschreibung Radiation Hardened Fast Sample and Hold
Hersteller Intersil Corporation
Logo Intersil Corporation Logo 




Gesamt 13 Seiten
HS-2420RH Datasheet, Funktion
HS-2420RH
July 1995
Radiation Hardened
Fast Sample and Hold
Features
Description
• Maximum Acquisition Time
- 10V Step to 0.1%. . . . . . . . . . . . . . . . . . . . . . . . . . . 4µs
- 10V Step to 0.01%. . . . . . . . . . . . . . . . . . . . . . . . . . 6µs
• Maximum Drift Current . . . . . . . . . . . . . . . . . . . . . .10nA
(Maximum Over Temperature)
• TTL Compatible Control Input
• Power Supply Rejection . . . . . . . . . . . . . . . . . . . . . .≥80dB
• Total Gamma Dose. . . . . . . . . . . . . . . . . 1 x 105 RAD(SI)
• No Latch-Up
Applications
• Data Acquisition Systems
• D to A Deglitcher
• Auto Zero Systems
• Peak Detector
• Gated Op Amp
Ordering Information
The HS-2420RH is a radiation hardened monolithic circuit
consisting of a high performance operational amplifier with
its output in series with an ultra-low leakage analog switch
and MOSFET input unity gain amplifier.
With an external hold capacitor connected to the switch output,
a versatile, high performance sample-and-hold or track-and-
hold circuit is formed. When the switch is closed, the device
behaves as an operation amplifier, and any of the standard op
amp feedback networks may be connected around the device
to control gain, frequency response, etc. When the switch is
opened the output will remain at its last level.
Performance as a sample-and-hold compares very favorably
with other monolithic, hybrid, modular, and discrete circuits.
Accuracy to better than 0.01% is achievable over the
temperature range. Fast acquisition is coupled with superior
droop characteristics, even at high temperatures. High slew
rate, wide bandwidth, and low acquisition time produce
excellent dynamic characteristics. The ability to operate at
gains greater than 1 frequently eliminates the need for
external scaling amplifiers.
The device may also be used as a versatile operational
amplifier with a gated output for applications such as analog
switches, peak holding circuits, etc.
PART NUMBER
HS1-2420RH-Q
TEMPERATURE
RANGE
PACKAGE
-55oC to +125oC 14 Lead CerDIP
Pinout
14 LEAD CERAMIC DUAL-IN-LINE
FRIT SEAL PACKAGE (CerDIP)
MIL-STD-1835, GDIP1-T14
TOP VIEW
IN- 1
IN+ 2
OFFSET ADJUST 3
OFFSET ADJUST 4
V- 5
NC 6
OUTPUT 7
14
SAMPLE/HOLD
CONTROL
13 GND
12 NC
14 Pin DIP 11 HOLD CAPACITOR
10 NC
9 V+
8 NC
Functional Diagram
OFFSET
ADJUST
34
V+
5
- INPUT 1
+ INPUT
2
14
SAMPLE/
HOLD
CONTROL
-
+
-
+
7
OUTPUT
HS-2420RH
13 5
11
GND V- HOLD
CAPACITOR
NOTE: Pin Numbers Correspond to DIP Package Only.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com | Copyright © Intersil Corporation 1999
1
Spec Number 518855
File Number 3554.1






HS-2420RH Datasheet, Funktion
Test Circuits
VDC
HS-2420RH
ALL RESISTORS = ±1%
ALL CAPACITORS = ±10%
10k
+VCC -VCC S/H
100k
S2
21
50
1
50
2 S1 1
2
S6
VAC
50
2
1 S7
1 S7
2
-
DUT
+
A
GND
1
S4
2 100k
1 OPEN 3
S5
CH =
1000pF
S3 2
3
+VCC
1M
1 50pF
2k
NULL
- AMP
+
ILOAD
-
+
X1
X-1
BUFFER
AOUT
EOUT
4
3
2
S8 1
FIGURE 1. TEST FIXTURE SCHEMATIC (SWITCH POSITIONS S1 - S8 DETERMINE CONFIGURATION)
+5V
SINEWAVE
INPUT
IN2 EN
IN1
IN3
IN4
IN5 OUT
IN6
IN7
IN8
A2
A1 A0
+15V -15V
-
+
DUT
2k
VIN CH =
1000pF
VOUT
50pF
+15V -15V
DUT
-
+
2k
50
S/H
CH =
1000pF
VOUT
50pF
SAMPLE/HOLD
CONTROL INPUT
NOTE: Compute Hold Mode Feedthrough Attenuation from the Formula:
Feedthrough A t t e n u a t i o n
=
20
log
V----V-O---I-U-N----T--H---H-O---O--L---LD---D---
Where VOUT HOLD = Peak-Peak Value of Output Sinewave during
the Hold Mode.
FIGURE 2. HOLD MODE FEEDTHROUGH ATTENUATION
6
GBWP is the Frequency of VINPUT at which:
20
log
V---V--I-N-O----P-U---U-T---T-- 
=
3dB
FIGURE 3. GAIN BANDWIDTH PRODUCT
Spec Number 518855

6 Page









HS-2420RH pdf, datenblatt
HS-2420RH
Intersil Space Level Product Flow -Q
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM) (Note 1)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Die Attach
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
CSI and/or GSI Pre-Cap (Note 7)
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In, Condition A, 240 Hours, +125oC or
Equivalent, Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% PDA, Method 5004 (Note 2)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic (X-Ray), Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
Sample - Group B, Method 5005 (Note 5)
Sample - Group C, Method 5005 (Notes 5, 6)
100% Data Package Generation (Note 8)
CSI and/or GSI Final (Note 7)
NOTES:
1. Modified SEM Inspection, not compliant to MIL-STD-883, Method 2018. This device does not meet the Class S minimum metal step
coverage of 50%. The metal does meet the current density requirement of <2E5A/cm2. Data provided upon request.
2. Failures from subgroup 1 and deltas are used for calculating PDA. The maximum allowable PDA = 5%.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for Group B test, Group B samples, Group D test and Group D samples.
6. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
P.O. should include a separate line item for Group D generic data. Generic data is not guaranteed to be available and is therefore not
available in all cases.
7. CSI and/or GSI inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for CSI Pre-Cap inspection, CSI Final Inspection, GSI Pre-Cap inspection, and/or GSI Final Inspection.
8. Data Package Contents:
Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quantity).
Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
GAMMA Radiation Report. Contains Cover page, disposition, RAD Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
X-Ray report and film. Includes penetrometer measurements.
Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
Lot Serial Number Sheet (Good units serial number and lot number).
Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
Group B and D attributes and/or Generic data is included when required by the P.O.
The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number 518855
12

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