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HS-201HSRH Schematic ( PDF Datasheet ) - Intersil Corporation

Teilenummer HS-201HSRH
Beschreibung BiCMOS Analog Switch
Hersteller Intersil Corporation
Logo Intersil Corporation Logo 




Gesamt 6 Seiten
HS-201HSRH Datasheet, Funktion
DATASHEET
Radiation Hardened High Speed, Quad SPST,
BiCMOS Analog Switch
HS-201HSRH, HS-201HSEH
The HS-201HSRH and HS-201HSEH are monolithic BiCMOS
analog switches featuring power-off high input impedance,
very fast switching speeds and low ON-resistance. Fabrication
on our DI RSG process ensures SEL immunity and only very
slight low dose rate sensitivity (ELDRS). These Class V/Q
devices are tested and guaranteed for 300krad(Si) total dose
performance.
Power-off high input impedance enables the use of this device
in redundant circuits without causing data bus signal
degradation. ESD protection, overvoltage protection, fast
switching times, low ON-resistance, and guaranteed radiation
hardness make the HS-201HSRH ideal for any space
application that requires improved switching performance.
Related Literature
• For a full list of related documents, visit our website
- HS-201HSRH product page
- HS-201HSEH product page
Features
• Electrically screened to DLA SMD# 5962-99618
• QML qualified per MIL-PRF-38535
• Radiation performance
- High dose rate (50-300rad(Si)/s). . . . . . . . . . . 300krad(Si)
- Low dose rate (0.01rad(SI)/s) . . . . . . . . . . . . . . 50krad(Si)
- SEL immune . . . . . . . . . . . . . . . . . . . . . . . . . DI RSG process
• Overvoltage protection (power on, switch off) . . . . . . . . ±30V
• Power off high impedance . . . . . . . . . . . . . . . . . . . . . . . . ±17V
• Fast switching times
- tON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110ns (max)
- tOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80ns (max)
• Low “ON” resistance . . . . . . . . . . . . . . . . . . . . . . . . 50Ωmax
• Pin compatible with industry standard 201 types
• Operating supply range . . . . . . . . . . . . . . . . . . . . ±10V to ±15V
• Wide analog voltage range (±15V supplies) . . . . . . . . . ±15V
• TTL compatible
Applications
• High speed multiplexing
• Sample and hold circuits
• Digital filters
• Operational amplifier gain switching networks
• Integrator reset circuits
Pin Configuration
HS1-201HSRH, HS1-201HSEH SBDIP (CDIP2-T16)
HS9-201HSRH, HS9-201HSEH FLATPACK (CDFP4-F16)
TOP VIEW
IN1 1
D1 2
S1 3
V- 4
GND 5
S4 6
D4 7
IN4 8
16 IN2
15 D2
14 S2
13 V+
12 NC
11 S3
10 D3
9 IN3
February 21, 2017
FN4874.4
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2000, 2006, 2013, 2014, 2017. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.






HS-201HSRH Datasheet, Funktion
HS-201HSRH, HS-201HSEH
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
-A- -D-
E
-B-
bbb S C A - B S D S
c1 LEAD FINISH
BASE
METAL
(c)
b1
MM
(b)
SECTION A-A
D
BASE
PLANE
S2 Q
-C- A
SEATING
PLANE
L
S1
b2
b
AA
e
eA/2
eA
c
ccc M C A - B S D S
aaa M C A - B S D S
NOTES:
1. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area
shown. The manufacturer’s identification shall not be used as a pin
one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension M
applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the base
plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C)
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
- 0.200 - 5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
- 0.840 - 21.34
-
E
0.220
0.310
5.59
7.87
-
e 0.100 BSC
2.54 BSC
-
eA 0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1 0.005 - 0.13 - 6
S2 0.005 - 0.13 - 7
a
90o 105o 90o 105o
-
aaa
- 0.015 - 0.38
-
bbb
- 0.030 - 0.76
-
ccc
- 0.010 - 0.25
-
M
-
0.0015
-
0.038
2
N 16
16 8
Rev. 0 4/94
Submit Document Feedback
6
For the most recent package outline drawing, see D16.3.
FN4874.4
February 21, 2017

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