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PDF BSM101 Data sheet ( Hoja de datos )

Número de pieza BSM101
Descripción SIMOPAC Module (Power module Single switch N channel Enhancement mode)
Fabricantes Siemens Semiconductor Group 
Logotipo Siemens Semiconductor Group Logotipo



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No Preview Available ! BSM101 Hoja de datos, Descripción, Manual

SIMOPAC® Module
VDS = 50 V
I D = 200 A
R DS(on) = 3.0 m
q Power module
q Single switch
q N channel
q Enhancement mode
q Package with insulated metal base plate
q Package outline/Circuit diagram: 11)
BSM 101 AR
Type
BSM 101 AR
Ordering Code
C67076-S1018-A2
Maximum Ratings
Parameter
Drain-source voltage
Drain-gate voltage, RGS = 20 k
Gate-source voltage
Continuous drain current, TC = 105 ˚C
Pulsed drain current, TC = 105 ˚C
Operating and storage temperature range
Power dissipation, TC = 25 ˚C
Thermal resistance, chip-case
Insulation test voltage2), t = 1 min.
Creepage distance, drain-source
Clearance, drain-source
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Symbol
VDS
VDGR
VGS
ID
ID puls
Tj, Tstg
Ptot
RthJC
Vis
Values
50
50
± 20
200
600
– 55 … + 150
700
0.18
2500
16
11
F
55/150/56
Unit
V
A
˚C
W
K/W
Vac
mm
1) See chapter Package Outline and Circuit Diagrams.
2) Insulation test voltage between drain and base plate referred to standard climate 23/50 in acc. with
DIN 50 014, IEC 146, para. 492.1.
Semiconductor Group
17
03.96

1 page




BSM101 pdf
Continuous drain-source current
ID = f (TC)
parameter: VGS 10 V, T j = 150 ˚C
BSM 101 AR
Drain-source breakdown voltage
V(BR)DSS = b × V(BR)DSS (25 ˚C)
Drain source on-state resistance
R =DS(on) f (ID)
parameter: VGS
Drain source on-state resistance
RDS (on) = f (Tj)
parameter: ID = 200 A; VGS = 10 V
Semiconductor Group
21

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