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Teilenummer | LV20S50E |
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Beschreibung | Schottky Diode | |
Hersteller | BLUE ROCKET ELECTRONICS | |
Logo | ||
Gesamt 6 Seiten LV20S50E
Rev.F May.-2016
描述 / Descriptions
TO-277 塑封封装 肖特基二极管。
TO-277 Plastic package Schottky diode.
DATA SHEET
特征 / Features
高正向浪涌能力,超低正向压降 VF(typ)=0.21V,优异的高温稳定性。
High Forward Surge Capability, Ultra Low Forward Voltage Drop VF(typ)=0.21V, Excellent High
Temperature Stability.
用途 / Applications
用于高频、低压、大电流整流二极管,续流二极管,保护二极管。
For use in low voltage,high frequency inverters, free wheeling, and polarity protection applications.
内部等效电路 / Equivalent Circuit
引脚排列 / Pinning
1
3
2
PIN1:Anode PIN 2:Cathode PIN 3:Anode
放大及印章代码 / hFE Classifications & Marking
见印章说明。See Marking Instructions.
Suggested Pad layout
http://www.fsbrec.com
1/6
LV20S50E
Rev.F May.-2016
DATA SHEET
回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
1、预热温度 25~150℃,时间 60~90sec;
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
3、焊接制程冷却速度为 2~10℃/sec.
Note:
1.Preheating:25~150℃, Time:60~90sec.
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions
温度:260±5℃
时间:10±1 sec.
Temp.:260±5℃
Time:10±1 sec
包装规格 / Packaging SPEC.
卷盘包装 / REEL
Package Type
封装形式
TO-277
Units/Reel
只/卷盘
5,000
Reels/Inner Box
卷盘/盒
3
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
只/盒
盒/箱
15,000
5
Units/Outer Box
只/箱
75,000
Dimension 包装尺寸 (unit:mm3)
Reel
Inner Box 盒
Outer Box 箱
13〞×12 360×360×50 385×257×392
使用说明 / Notices
http://www.fsbrec.com
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6 Page | ||
Seiten | Gesamt 6 Seiten | |
PDF Download | [ LV20S50E Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
LV20S50E | Schottky Diode | BLUE ROCKET ELECTRONICS |
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