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Teilenummer | LV10S45D |
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Beschreibung | Schottky Barrier Diode | |
Hersteller | BLUE ROCKET ELECTRONICS | |
Logo | ||
Gesamt 6 Seiten LV10S45D
Rev.F Mar.-2016
描述 / Descriptions
TO-252 塑封封装 肖特基二极管。
Schottky Barrier Diode in a TO-252 Plastic Package.
DATA SHEET
特征 / Features
高正向浪涌能力,超低正向压降 VF(typ)=0.2V,优异的高温稳定性。
High Forward Surge Capability, Ultra Low Forward Voltage Drop VF(typ)=0.2V, Excellent High
Temperature Stability.
用途 / Applications
用于高频、低压、大电流整流二极管,续流二极管,保护二极管。
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
内部等效电路 / Equivalent Circuit
引脚排列 / Pinning
12
3
4
PIN1:Anode PIN 2,4:Cathode PIN 3:Anode
放大及印章代码 / hFE Classifications & Marking
见印章说明。See Marking Instructions.
Suggested Pad layout
http://www.fsbrec.com
1/6
LV10S45D
Rev.F Mar.-2016
DATA SHEET
回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
1、预热温度 25~150℃,时间 60~90sec;
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
3、焊接制程冷却速度为 2~10℃/sec.
Note:
1.Preheating:25~150℃, Time:60~90sec.
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions
温度:260±5℃
时间:10±1 sec.
Temp.:260±5℃
Time:10±1 sec
包装规格 / Packaging SPEC.
卷盘包装 / REEL
Package Type
封装形式
TO-252
Units/Reel
只/卷盘
2,500
Reels/Inner Box
卷盘/盒
2
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
只/盒
盒/箱
5,000
5
Units/Outer Box
只/箱
25,000
Dimension 包装尺寸 (unit:mm3)
Reel
Inner Box 盒
Outer Box 箱
13〞 ×16 360×360×50 385×257×392
套管包装 / TUBE
Package Type
封装形式
TO-251/252
Units/Tube
只/套管
75
Tubes/Inner Box
套管/盒
48
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
只/盒
盒/箱
3,600
5
Units/Outer Box
只/箱
18,000
Dimension 包装尺寸 (unit:mm3)
Tube 套管
Inner Box 盒
Outer Box 箱
526×20.5×5.25 555×164×50 575×290×180
使用说明 / Notices
http://www.fsbrec.com
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6 Page | ||
Seiten | Gesamt 6 Seiten | |
PDF Download | [ LV10S45D Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
LV10S45D | Schottky Barrier Diode | BLUE ROCKET ELECTRONICS |
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