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MMBTA64 Schematic ( PDF Datasheet ) - MCC

Teilenummer MMBTA64
Beschreibung PNP Darlington Transistor
Hersteller MCC
Logo MCC Logo 




Gesamt 3 Seiten
MMBTA64 Datasheet, Funktion
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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MMBTA63
MMBTA64
Features
This device is designed for applications requiring extremely high
current gain at 500mA.
Marking : MMBTA63: 2U
MMBTA64: 2V
Case Material:Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Maximum Ratings
Symbol
Rating
Rating
Unit
VCEO
Collector-Emitter Voltage
VCBO
VEBO
IC
Collector-Base Voltage
Emitter-Base Voltage
Collector Current, Continuous
TJ
TSTG
Operating Junction Temperature
Storage Temperature
Thermal Characteristics
30
30
10
0.5
-55 to +150
-55 to +150
V
V
V
A
OC
OC
Symbol
Rating
Max
Unit
PC Collector Power Dissipation*
300 mW
RJA Thermal Resistance, Junction to Ambient
417
OC/W
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
Parameter
OFF CHARACTERISTICS
V(BR)CEO Collector-base breakdown voltage
(IC=100uAdc, IE=0)
V(BR)CBO Collector-emitter breakdown voltage
(IC=100uAdc, IB=0)
V(BR)EBO Emitter-base breakdown voltage
(IE=100uAdc, IC=0)
ICBO Collector Cutoff Current
(VCB=30Vdc, IE=0)
IEBO Emitter Cutoff Current
(VEB=10Vdc, IC=0)
ON CHARACTERISTICS
hFE1 DC Current Gain
(VCE=5.0Vdc, IC=10mAdc) MMBTA63
MMBTA64
hFE2 DC Current Gain
(VCE=5.0Vdc, IC=100mA) MMBTA63
MMBTA64
VCE(sat)
VBE(sat)
fT
Collector-Emitter Saturation Voltage
(IC=100mAdc, IB=0.1mAdc)
Base-Emitter On Voltage
(IC=100mAdc, VCE=5.0Vdc)
Current-Gain—Bandwidth Product
(IC=10mAdc, VCE=5.0Vdc, f=100MHz)
Min
30
30
10
---
---
5000
10000
10000
20000
---
---
125
Max
---
---
---
100
100
---
---
---
---
1.5
2.0
---
Units
Vdc
Vdc
Vdc
nAdc
nAdc
---
---
---
---
Vdc
Vdc
MHz
PNP Darlington
Transistor
SOT-23
A
D
CB
C
FE
BE
G HJ
K
DIMENSIONS
INCHES
MM
DIM MIN
MAX
MIN
MAX
NOTE
A .110 .120 2.80 3.04
B .083 .098 2.10 2.64
C .047 .055 1.20 1.40
D .035 .041 .89 1.03
E .070 .081 1.78 2.05
F .018 .024 .45
.60
G
.0005
.0039
.013
.100
H .035 .044 .89 1.12
J .003 .007 .085 .180
K .015 .020 .37
.51
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision:5
www.mccsemi.com
1 of 3
2008/12/11





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