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PDF MMBD2010T1 Data sheet ( Hoja de datos )
| Número de pieza | MMBD2010T1 | |
| Descripción | Switching Diode | |
| Fabricantes | ON Semiconductor | |
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MMBD1010LT1
Switching Diode
Part of the GreenLine™ Portfolio of devices with
energy−conserving traits.
This switching diode has the following features:
• Very Low Leakage (≤ 500 pA) promotes extended battery life by
decreasing energy waste. Guaranteed leakage limit is for each diode
in the pair contingent upon the other diode being in a
non−forward−biased condition.
• Offered in four Surface Mount package types
• Available in 8 mm Tape and Reel in quantities of 3,000
Applications
• ESD Protection
• Reverse Polarity Protection
• Steering Logic
• Medium−Speed Switching
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
DEVICE MARKING
VR 30 Vdc
IF 200 mAdc
IFM
(surge)
500
mA
MMBD1010LT1 = A5
MMBD2010T1 = DP
MMBD3010T1 = XS
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-4 Board (1)
TA = 25°C
MMBD1010LT1,
MMBD3010T1
MMBD2010T1
Derate above 25°C MMBD1010LT1,
MMBD3010T1
MMBD2010T1
Symbol
PD
Max
225
150
1.8
1.2
Unit
mW
mW/°C
Thermal Resistance Junction to
Ambient
MMBD1010LT1,
MMBD3010T1
MMBD2010T1
RθJA
°C/W
556
833
Junction and Storage Temperature
TJ, Tstg − 55 to +150
°C
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
Preferred devices are Motorola recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 2
1
http://onsemi.com
MMBD1010LT1
3
1
2
CASE 318-08, STYLE 9
SOT-23 (TO-236AB)
MMBD2010T1
3
1
2
CASE 419-02, STYLE 5
SC−70/SOT−323
MMBD3010T1
2
1
3
CASE 318D-04, STYLE 3
SC−59
3
CATHODE
ANODE
1
2
ANODE
Publication Order Number:
MMBD1010LT1/D
1 page  
MMBD1010LT1
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 2 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering systems
but it is a good starting point. Factors that can affect the
profile include the type of soldering system in use, density
and types of components on the board, type of solder used,
and the type of board or substrate material being used. This
profile shows temperature versus time. The line on the
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a
central solder joint. The two profiles are based on a high
density and a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177 −189°C.
When this type of furnace is used for solder reflow work, the
circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction.
The circuit board, because it has a large surface area,
absorbs the thermal energy more efficiently, then distributes
this energy to the components. Because of this effect, the
main body of a component may be up to 30 degrees cooler
than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
SOAK"
SPIKE"
DESIRED CURVE FOR HIGH
170°C
MASS ASSEMBLIES
160°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 2. Typical Solder Heating Profile
http://onsemi.com
5
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| PDF Descargar | [ Datasheet MMBD2010T1.PDF ] | |
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