VLMO31J1K2-GS08 Datasheet PDF - Vishay
| Part Number | VLMO31J1K2-GS08 | |
| Description | Standard SMD LED PLCC-2 | |
| Manufacturers | Vishay | |
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VLMO31..
Vishay Semiconductors
Standard SMD LED PLCC-2
948553
DESCRIPTION
This device has been designed for applications requiring
narrow brightness and color selection.
The package of this device is the PLCC-2.
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled up
with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
FEATURES
• SMD LED with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
equipment
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and
wave solder processes according to CECC
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to
light pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging
IVmax./IVmin. ≤ 1.6
• Preconditioning according to JEDEC® level 2a
unit
• ESD-withstand voltage: up to 2 kV according to
JESD22-A114-B
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive: backlighting in dashboards and switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches, and symbols
• General use
PARTS TABLE
PART
VLMO31J1K2-GS08
VLMO31J1K2-GS18
VLMO31J1K2-35-GS08
VLMO31J1L2-GS08
VLMO31J1L2-GS18
VLMO31K1L2-GS08
VLMO31K1L2-GS18
COLOR
LUMINOUS
INTENSITY
(mcd)
at IF
(mA)
WAVELENGTH
(nm)
at IF
(mA)
FORWARD
VOLTAGE
(V)
at IF
(mA)
TECHNOLOGY
MIN. TYP. MAX.
MIN. TYP. MAX.
MIN. TYP. MAX.
Soft orange 4.5 8.6 11.2 10 598 605 611 10 - 2.2 2.8 20 GaAsP on GaP
Soft orange 4.5 8.6 11.2 10 598 605 611 10 - 2.2 2.8 20 GaAsP on GaP
Soft orange 4.5 8.6 11.2 10 602 605 609 10 - 2.2 2.8 20 GaAsP on GaP
Soft orange 4.5 8.6 18 10 598 605 611 10 - 2.2 2.8 20 GaAsP on GaP
Soft orange 4.5 8.6 18 10 598 605 611 10 - 2.2 2.8 20 GaAsP on GaP
Soft orange 7.1 9 18 10 598 605 611 10 - 2.2 2.8 20 GaAsP on GaP
Soft orange 7.1 9 18 10 598 605 611 10 - 2.2 2.8 20 GaAsP on GaP
Rev. 1.5, 03-Aug-15
1 Document Number: 81333
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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VLMO31..
Vishay Semiconductors
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM.3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component insertion.
The blister tape is a plastic strip with impressed component
cavities, covered by a top tape.
Adhesive tape
Blister tape
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
120°
10.4
8.4
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Component cavity
TAPING OF VLM.3...
3.5
3.1
94 8670
2.2
2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 9 - Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
Fig. 11 - Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC level 2a
300
250
225555°C°C
240 °C
217 °C
200
150
100
max. 120 s
max. 260 °C
245 °C
max. 30 s
max. 100 s
max. ramp up 3 °C/s
50
max. ramp down 6 °C/s
0
0
19470-2
50 100 150 200 250 300
Time (s)
max. 2 cycles allowed
Fig. 12 - Vishay Leadfree Reflow Soldering Profile
(acc. to J-STD-020)
120°
10.0
9.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Fig. 10 - Reel Dimensions - GS08
TTW Soldering (acc. to CECC00802)
300
5s
lead temperature
250 235 °C
to 260 °C
first wave
200
second
wave full line: typical
dotted line: process limits
ca. 200 K/s
150 100 °C
to 130 °C
100
ca. 2 K/s
2 K/s
ca. 5 K/s
50
forced cooling
0
0
948626-1
50 100 150 200 250
Time (s)
Fig. 13 - Double Wave Soldering of Opto Devices (all Packages)
Rev. 1.5, 03-Aug-15
5 Document Number: 81333
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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