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PDF VLMF2300 Data sheet ( Hoja de datos )
| Número de pieza | VLMF2300 | |
| Descripción | Power Mini SMD LED | |
| Fabricantes | Vishay | |
| Logotipo |  |
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www.vishay.com
VLMK2300, VLMF2300, VLME2300
Vishay Semiconductors
Power Mini SMD LED
19226
DESCRIPTION
The new MiniLED series have been designed in a small white
SMT package. The feature of the device is the very small
package 2.3 mm x 1.3 mm x 1.4 mm. The MiniLED is an
obvious solution for small-scale, high-power products that
are expected to work reliability in an arduous environment.
This is often the case in automotive and industrial
application.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD MiniLED
• Product series: power
• Angle of half intensity: ± 60°
FEATURES
• SMD LEDs with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
equipment
• IR reflow soldering
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to
light pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packing unit
IVmax./IVmin. ≤ 1.6
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive: backlighting in dashboards and switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches, and symbols
PARTS TABLE
PART
COLOR
LUMINOUS INTENSITY
WAVELENGTH
FORWARD VOLTAGE
(mcd)
at IF
(mA)
(nm)
at IF
(mA)
(V)
at IF
(mA)
TECHNOLOGY
MIN. TYP. MAX.
MIN. TYP. MAX.
MIN. TYP. MAX.
VLMK2300-GS08 Super-red 35.5 90
- 20 - 630 - 20 - 1.9 2.6 20 AlInGaP on GaAs
VLMF2300-GS08 Soft orange 56 112
- 20 598 605 611 20 -
2.0 2.6 20 AlInGaP on GaAs
VLME2300-GS08 Yellow
56 112
- 20 581 588 594 20 -
2.0 2.6 20 AlInGaP on GaAs
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
VLMK2300, VLMF2300, VLME2300
PARAMETER
TEST CONDITION
Reverse voltage (1)
DC forward current
Single forward current
Power dissipation
Junction temperature
Tamb ≤ 80 °C
tp ≤ 10 μs
Tamb ≤ 80 °C
Operating temperature range
Storage temperature range
Soldering temperature
According to IPC 9501
Thermal resistance junction/ambient Mounted on PC board (pad size > 5 mm2)
SYMBOL
VR
IF
IFSM
PV
Tj
Tamb
Tstg
Tsd
RthJA
Note
(1) Driving the LED in reverse direction is suitable for a short term application
VALUE
5
30
0.1
80
+125
-40 to +100
-40 to +100
245
580
UNIT
V
mA
A
mW
°C
°C
°C
°C
K/W
Rev. 1.8, 28-Nov-14
1 Document Number: 81219
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1 page  
www.vishay.com
VLMK2300, VLMF2300, VLME2300
Vishay Semiconductors
1.6
1.4 orange
1.2
1.0
0.8
0.6
0.4
IF = 20 mA
0.2
0.0
0
17504
10 20 30 40 50 60 70 80 90 100
Tamb - Ambient Temperature (°C)
Fig. 9 - Relative Luminous Intensity vs. Ambient Temperature
10
orange
1
0.1
0.01
1
17505
10
IF - Forward Current (mA)
100
Fig. 10 - Relative Luminous Intensity vs. Forward Current
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
560
17506
orange
580 600 620 640
- Wavelength (nm)
660
Fig. 11 - Relative Intensity vs. Wavelength
2.10
2.05
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
1.60
0
17507
orange
IF = 20 mA
10 20 30 40 50 60 70 80 90 100
T - Ambient Temperature (°C)
amb
Fig. 12 - Forward Voltage vs. Ambient Temperature
100
yellow
10
1
1
95 10878y
1.5 2 2.5 3
VF - Forward Voltage (V)
Fig. 13 - Forward Current vs. Forward Voltage
1.6
yellow
1.4
1.2
1.0
0.8
0.6
0.4
0.2 IF = 20 mA
0.0
0 10 20 30 40 50 60 70 80 90 100
17508 Tamb - Ambient Temperature (°C)
Fig. 14 - Relative Luminous Intensity vs. Ambient Temperature
Rev. 1.8, 28-Nov-14
5 Document Number: 81219
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 Page 
www.vishay.com
VLMK2300, VLMF2300, VLME2300
Vishay Semiconductors
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
Label
Reel
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard JESD22-A112 level 2a label is
included on all dry bags.
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
LEVEL
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a) Humidity Indicator Card is >10% when read at 23°C + 5°C or
b) 2a or 2b is not met.
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
96 hours at 60±5oCand <5%RH
For all device containers or
24 hours at 100±5°C
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
Example of JESD22-A112 level 2a label
19786
Rev. 1.8, 28-Nov-14
11 Document Number: 81219
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet VLMF2300.PDF ] | |
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