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PDF TNPW0805-e3 Data sheet ( Hoja de datos )
| Número de pieza | TNPW0805-e3 | |
| Descripción | High Stability Thin Film Flat Chip Resistors | |
| Fabricantes | Vishay | |
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TNPW e3
Vishay
High Stability Thin Film Flat Chip Resistors
FEATURES
• Superior moisture resistivity (85 °C; 85 % RH)
• Excellent overall stability at different
environmental conditions 0.05 % (1000 h
rated power at 70 °C)
• AEC-Q200 qualified (sizes 0402 to 1206)
• Single lot date code (optional)
• Sulfur resistance verified according to ASTM B 809
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TNPW e3 precision thin film flat chip resistors are the perfect
choice for most fields of modern electronics where highest
reliability and stability is of major concern. Typical
applications include test and measuring equipment, medical
equipment, industrial, and automotive.
APPLICATIONS
• Test and measuring equipment
• Medical equipment
• Industrial equipment
• Automotive
TECHNICAL SPECIFICATIONS
DESCRIPTION
TNPW0402 e3 TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
Imperial size
0402
0603
0805
1206
Metric size code
RR1005M
RR1608M
RR2012M
RR3216M
Resistance range
10 to 100 k 4.7 to 332 k 4.7 to 1 M
4.7 to 2 M
Resistance tolerance
± 1 %; ± 0.5 %; ± 0.1 %
Temperature coefficient
± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Rated dissipation, P70 (2)
Operating voltage, Umax. ACRMS or DC
Permissible film temperature, F max. (2)
Operating temperature range
0.100 W
50 V
0.125 W
75 V
0.200 W
150 V
155 °C
-55 °C to 155 °C
0.400 W
200 V
Permissible voltage against ambient
(insulation):
1 min; Uins
75 V
100 V
Failure rate: FITobserved
Notes
(1) The detail specification EN 140401-801 does not cover this product size.
(2) Please refer to APPLICATION INFORMATION, see next page.
200 V
0.1 x 10-9/h
300 V
TNPW1210 e3 (1)
1210
RR3225M
10 to 3.01 M
0.500 W
200 V
300 V
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
Revision: 12-May-16
1 Document Number: 28758
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1 page  
www.vishay.com
TNPW e3
Vishay
DESCRIPTION
MATERIALS
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (AI2O3) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. A further conditioning is applied in order to
stabilize the trimming result. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with a
potential risk of early life failures (feasible for R 10 ). Only
accepted products are laid directly into the tape in
accordance with IEC 60286-3, Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances Directive (RoHS) with amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
RELATED PRODUCTS
The TNPW with SnPb termination plating is designed for
those applications, where lead bearing terminations are
mandatory. For ordering TNPW with SnPb terminations
please refer to latest edition of datasheet TNPW
(www.vishay.com/doc?31006).
TNPU e3 ultra precision thin film flat chip resistors combine
the proven reliability of TNPW e3 products with a most
advanced level of precision and stability
(www.vishay.com/doc?28779).
TNPS .... ESCC high-reliability thin film chip resistors are the
premium choice for design and manufacture of equipment,
where matured technology and proven reliability are
of utmost importance. They are regularly used in
communication and research satellites and fit equally well
into aircraft and military electronic systems.
Approval of the TNPS .... ESCC products is granted by the
European Space Components Coordination and registered
in the ESCC Qualified Parts List, REP005
(www.vishay.com/doc?28789).
TNPV e3 High Voltage Thin Film Flat Chip Resistors are
designed for most fields of modern electronics where
precision, reliability and stability at high operating voltage
are primary concerns (www.vishay.com/doc?28881).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
Revision: 12-May-16
5 Document Number: 28758
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 Page 
www.vishay.com
TNPW e3
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 IEC 60068-2 (1)
CLAUSE TEST METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
TNPW0402 e3
TNPW0603 e3
TNPW0805 e3
TNPW1206 e3
TNPW1210 e3
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
4.17
58 (Td)
Solderability
Solder bath method;
Good tinning ( 95 % covered);
no visible damage
SnAg3Cu0.5 or SnAg3.5; non-activated
flux
(235 ± 3) °C; (2 ± 0.2) s
4.18
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.02 % R + 0.01 )
Component
4.29
45 (XA)
solvent
Isopropyl alcohol + 50 °C; method 2
resistance
No visible damage
4.32
21 (Ue3)
Shear
(adhesion)
TNPW0402 e3 and TNPW0603 e3: 9 N
TNPW0805 e3 and TNPW1206 e3: 45 N
No visible damage
4.33
21 (Ue1)
Substrate
bending
Depth 2 mm, 3 times
± (0.05 % R + 0.01 )
no visible damage,
no open circuit in bent position
4.7
4.35
- Voltage proof
- Flammability
URMS = Uins; 60 ± 5 s
IEC 60695-11-5 (1),
needle flame test; 10 s
No flashover or breakdown
No burning after 30 s
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
Revision: 12-May-16
11 Document Number: 28758
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet TNPW0805-e3.PDF ] | |
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