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ADRF5021 Schematic ( PDF Datasheet ) - Analog Devices

Teilenummer ADRF5021
Beschreibung Silicon SPDT Switch
Hersteller Analog Devices
Logo Analog Devices Logo 




Gesamt 13 Seiten
ADRF5021 Datasheet, Funktion
Data Sheet
FEATURES
Ultrawideband frequency range: 9 kHz to 30 GHz
Nonreflective 50 Ω design
Low insertion loss: 2.0 dB to 30 GHz
High isolation: 60 dB to 30 GHz
High input linearity
1 dB power compression (P1dB): 28 dBm typical
Third-order intercept (IP3): 52 dBm typical
High power handling
24 dBm through path
24 dBm terminated path
ESD sensitivity: Class 1, 1 kV human body model (HBM)
20-terminal, 3 mm × 3 mm land grid array package
No low frequency spurious
Radio frequency (RF) settling time (to 0.1 dB of final RF
output): 6.2 µs
APPLICATIONS
Test instrumentation
Microwave radios and very small aperture terminals (VSATs)
Military radios, radars, electronic counter measures (ECMs)
Broadband telecommunications systems
GENERAL DESCRIPTION
The ADRF5021 is a general-purpose single-pole, double-throw
(SPDT) switch manufactured using a silicon process. It comes
in a 3 mm × 3 mm, 20-terminal land grid array (LGA) package
and provides high isolation and low insertion loss from 9 kHz
to 30 GHz.
9 kHz to 30 GHz,
Silicon SPDT Switch
ADRF5021
FUNCTIONAL BLOCK DIAGRAM
RF2
ADRF5021
RFC
50Ω
50Ω
VSS
EN
CTRL
VDD
RF1
Figure 1.
This broadband switch requires dual supply voltages, +3.3 V
and −2.5 V, and provides CMOS/LVTTL logic-compatible
control.
Rev. A
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Technical Support
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ADRF5021 Datasheet, Funktion
Data Sheet
ABSOLUTE MAXIMUM RATINGS
For recommended operating conditions, see Table 1.
Table 2.
Parameter
Supply Voltage
Positive
Negative
Digital Control Input Voltage
RF Input Power1 (f = 1 MHz to 30 GHz,
TCASE = 85°C)
Through Path
Terminated Path
Hot Switching
Temperature
Junction (TJ)
Storage
Reflow (MSL3 Rating)
Junction to Case Thermal Resistance, θJC
Through Path
Terminated Path
ESD Sensitivity
HBM
Rating
−0.3 V to +5.5 V
−2.75 V to +0.3 V
−0.3 V to VDD + 0.3 V
27 dBm
25 dBm
21 dBm
135°C
−65°C to +150°C
260°C
420°C/W
160°C/W
1 kV (Class 1)
1 For power derating at frequencies less than 1 MHz, see Figure 2 to Figure 4.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating can be applied at any one time.
POWER DERATING CURVES
4
2
TCASE = 85°C
0
–2
–4
–6
–8
–10
–12
–14
10k
100k
1M 10M 100M
FREQUENCY (Hz)
1G
10G 30G
Figure 2. Power Derating for Through Path vs. Frequency, TCASE = 85°C
ADRF5021
4
TCASE = 85°C
2
0
–2
–4
–6
–8
–10
–12
–14
10k
100k
1M
10M 100M
1G
10G 30G
FREQUENCY (Hz)
Figure 3. Power Derating for Terminated Path vs. Frequency, TCASE = 85°C
4
TCASE = 85°C
2
0
–2
–4
–6
–8
–10
–12
–14
10k
100k
1M 10M 100M
FREQUENCY (Hz)
1G
10G 30G
Figure 4. Power Derating for Hot Switching vs. Frequency, TCASE = 85°C
ESD CAUTION
Rev. A | Page 5 of 12

6 Page









ADRF5021 pdf, datenblatt
Data Sheet
ADRF5021
J7
DEPOP
J3
J1
THR_CAL
RF2
RFC
J8
DEPOP
TP1
20 19 18 17 16
GND 1
15 VSS
GND 2
14 EN
RFC 3 U1 13 GND
GND 4
12 CTRL
GND 5
11 VDD
6 7 8 9 10
C4
100pF
C3
100nF
DEPOP
R1
0Ω
VSS
C6
10µF
DEPOP
EN
C5
100pF
R2
0Ω
C2
100pF
DEPOP
CTRL
VDD
C1
10µF
DEPOP
TP2
TP3
TP4
TP5
RF1
J2
Figure 21. Evaluation Board Schematic
Table 5. Bill of Materials, Evaluation Board Components
Component Description
J1, J2, J3
End launch connectors, 2.4 mm
J7, J8
Unpopulated end launch connectors, 2.4 mm
TP1 to TP5 Through hole mount test points
C4, C5
100 pF capacitors, 0402 package
C2, C3
Unpopulated capacitors, 0402 package
C1, C6
Unpopulated capacitors, 0603 package
R1, R2
0 Ω resistors, 0402 package
U1 ADRF5021 SPDT switch
PCB 600-01583-00-1 evaluation PCB
PROBE MATRIX BOARD
Figure 22 and Figure 23 show the top and cross sectional views
of the probe matrix board that measures the s-parameters of the
ADRF5021 at close proximity to RF pins using the GSG probes.
The actual board duplicates the same layout in matrix form to
assemble multiple devices and uses RF traces for through,
reflect, and line (TRL) calibration.
220mil
340mil
Figure 22. Probe Board Layout (Top View)
0.5oz Cu
G = 5mil
W = 14mil
0.5oz Cu
0.5oz Cu
T = 0.7mil
RO4003
H = 8mil
0.5oz Cu
Figure 23. Probe Matrix Board (Cross Sectional View)
Rev. A | Page 11 of 12

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