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HI-1581 Schematic ( PDF Datasheet ) - HOLTIC

Teilenummer HI-1581
Beschreibung 3.3V Monolithic Dual Transceivers
Hersteller HOLTIC
Logo HOLTIC Logo 




Gesamt 11 Seiten
HI-1581 Datasheet, Funktion
July 2016
HI-1579, HI-1581
MIL-STD-1553 / 1760
3.3V Monolithic Dual Transceivers
DESCRIPTION
The HI-1579 and HI-1581 are low power CMOS dual
transceivers designed to meet the requirements of the
MIL-STD-1553 and MIL-STD-1760 specifications.
The transmitter section of each bus takes complementary
CMOS / TTL Manchester II bi-phase data and converts it to
differential voltages suitable for driving the bus isolation
transformer. Separate transmitter inhibit control signals are
provided for each transmitter.
The receiver section of the each bus converts the 1553 bus
bi-phase data to complementary CMOS / TTL data suitable
for input to a Manchester decoder. Each receiver has a
separate enable input, which forces the receiver outputs to
logic "0" (HI-1579) or logic 1 (HI-1581).
To minimize the package size for this function, the
transmitter outputs are internally connected to the receiver
inputs, so that only two pins are required for connection to
each coupling transformer.
FEATURES
· Compliant to MIL-STD-1553A and B,
MIL-STD-1760 and ARINC 708A
· 3.3V single supply operation
PIN CONFIGURATIONS
-1
RXENA 2
GNDA 3
GNDA 4
GNDA 5
VDDB 6
VDDB 7
BUSB 8
BUSB 9
BUSB 10
BUSB 11
1579PCI
1579PCT
1579PCM
1581PCI
1581PCT
1581PCM
33 -
32 -
31 TXINHA
30 RXA
29 RXA
28 -
27 -
26 TXB
25 TXB
24 TXINHB
23 -
44 Pin Plastic 7mm x 7mm
Chip-scale package
VDDA 1
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDB 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
1579PSI
1579PST
1579PSM
1581PSI
1581PST
1581PSM
20 TXA
19 TXA
18 TXINHA
17 RXA
16 RXA
15 TXB
14 TXB
13 TXINHB
12 RXB
11 RXB
20 Pin Plastic ESOIC - WB package
· Smallest footprint available in 7mm x 7mm
44 pin plastic chip-scale package (QFN)
· 1.0W typical power dissipation
(50% duty cycle)
· Industrial and extended temperature
ranges
· Industry standard pin configurations
VDDA 1
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDB 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
1579CDI
1579CDT
1579CDM
1581CDI
1581CDT
1581CDM
20 TXA
19 TXA
18 TXINHA
17 RXA
16 RXA
15 TXB
14 TXB
13 TXINHB
12 RXB
11 RXB
20 Pin Ceramic DIP package
(DS1579 Rev. O)
HOLT INTEGRATED CIRCUITS
www.holtic.com
07/16






HI-1581 Datasheet, Funktion
HI-1579, HI-1581
VDD Each Bus
TXA/B
TXA/B
RXA/B
RXA/B
Isolation
Transformer
MIL-STD-1553
Transceiver
HI-1579 / HI-1581
1:2.5
55W BUS A/B
35W
55W BUS A/B
GND
Figure 3. Direct Coupled Test Circuit
Point
“AD”
VDD Each Bus
TXA/B
TXA/B
RXA/B
RXA/B
MIL-STD-1553
Transceiver
HI-1579 / HI-1581
Isolation
Transformer BUS A/B
1:2.5
BUS A/B
70W
GND
Figure 4. Transformer Coupled Test Circuit
Point
“AT”
HEAT SINK
ESOIC & CHIP-SCALE PACKAGES
The HI-1579PSI/T/M and HI-1581PSI/T/M use a 20-pin
thermally enhanced SOIC package. The HI-1579PCI/T/M
and HI-1581PCI/T/M use a plastic chip-scale package
(QFN). These packages include a metal heat sink located
on the bottom surface of the device. This heat sink may
be soldered down to the printed circuit board for optimum
thermal dissipation. The heat sink is electrically isolated
and may be soldered to any convenient power or ground
plane.
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design notes
regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.
THERMAL CHARACTERISTICS
PART NUMBER PACKAGE STYLE CONDITION
HI-1579PSI / T / M
HI-1581PSI / T /M
20-pin Thermally
enhanced plastic
SOIC ( ESOIC)
HI-1579CDI / T / M
HI-1579CDI / T / M
HI-1579PCI / T / M
HI-1581PCI / T / M
20-pin Ceramic
side-brazed
44-Plastic chip-
scale package (QFN)
Heat sink
unsoldered
Heat sink
soldered
Socketed
Heat sink
unsoldered
JUNCTION TEMPERATURE
ØJA TA=25°C TA=85°C TA=125°C
54°C/W 68°C 130°C 170°C
47°C/W 63°C 124°C 165°C
62°C/W 74°C 136°C 175°C
49°C/W 65°C 126°C 166°C
Data taken at VDD=3.3V, continuous transmission at 1Mbit/s, single transmitter enabled.
HOLT INTEGRATED CIRCUITS
6

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