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WS3413E Schematic ( PDF Datasheet ) - WINSEMI

Teilenummer WS3413E
Beschreibung Non-isolated Buck APFC Offline LED Driver
Hersteller WINSEMI
Logo WINSEMI Logo 




Gesamt 9 Seiten
WS3413E Datasheet, Funktion
WS3413EProductDescription
Features
Specially Optimized for the EMI
Internal 550V Power MOSFET
Active PFC for High Power Factor and Low THD
Critical Conduction Mode Operation
System Efficiency up to 95%
Without auxiliary winding
Excellent Line and Load Regulation
±3% LED Output Current Accuracy
Thermal Regulation Function
LED Short/Open Protection
Current Sensing Resistor Open Protection
Auto Fault Recovery
Available in DIP7/SOP7 Package
Applications
E27 LED Bulb, Spot Light
PAR30, PAR38 Lamp
T8/T10 LED String
Other LED Lighting
Typical Application
Non-isolated Buck APFC Offline LED Driver
Description
The WS3413E is a high precision non-isolated buck
driver with active PFC, specially designed for universal input
offline constant current LED lighting. The driver with on-chip
PFC circuit achieves high power factor and low THD.
Operating in critical conduction mode, the power MOSFET
switching loss is reduced and the inductor is fully utilized.
The WS3413E integrates a 550V power MOSFET. With
few external components, the LED output current can be
precisely controlled.
The WS3413E offers rich protection functions to improve
the system reliability, including LED open circuit protection,
LED short circuit protection, CS resistor open circuit
protection and cycle by cycle current limit. All the protection
functions are auto-recovery. The system reliability is further
improved by the thermal regulation function. The output
current is reduced when the driver is over temperature.
The WS3413E has ultra low start up current and ultra low
operating current.
The WS3413E is available in DIP7/SOP7 Package.
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WS3413E Datasheet, Funktion
WS3413E ProductDescription
Bypass Capacitor
The bypass capacitor on VCC pin should be as close as
possible to the VCC and GND pins.
Ground Path
The power ground path for current sense resistor should
be short and wide, and it should be as close as possible to the
IC ground (pin 2) , otherwise the LED output current accuracy
maybe affected. The IC signal ground for COMP and FB
components should be connected to the IC GND pin with
short traces and should be away from the power ground path.
The Area of Power Loop
The area of main current loop should be as small as
possible to reduce EMI radiation.
FB Pin
The feedback resistor divider should be as close as
possible to the FB pin, and the trace must keeps away from
dynamic node of the inductor (DRAIN pin tracethe positive
pin and the negative pin of Vo trace), otherwise the FB pin
OVP function might have risk to be mis-triggered by the
system noise.
DRAIN Pin
To increase the copper area of DRAIN pin for better
thermal dissipation. However, too large copper area may
compromise EMI performance.
The material of PCB
Avoid choosing the material that is easy to absorb the
moisture, just like paper copper-clad laminates.
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