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PDF VLA531-01R Data sheet ( Hoja de datos )

Número de pieza VLA531-01R
Descripción Hybrid IC for driving IGBT modules
Fabricantes Isahaya Electronics 
Logotipo Isahaya Electronics Logotipo



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HYBRID IC
VLA531-01R
Hybrid IC for driving IGBT modules
DESCRIPTION
VLA531 is a hybrid integrated circuit designed for driving
n-channel IGBT modules in any gate-amplifier application. This
device operates as an isolation amplifier for these modules and
provides the required electrical isolation between the input and
output with an opto-coupler.
Recommended IGBT modules:
VCES = 600V series up to 200A class
VCES = 1200V series up to 150A class
OUTLINE DRAWING
42 MAX
FEATURES
•Electrical isolation between input and output with opto-coupler
(Viso = 2500Vrms for 1minute)
•Two supply driver topology
•Built-in short circuit protection circuit (Soft shut down)
•CMOS compatible input interface
4.5MAX
2.54
1
0.5
+0.15
-0.1
14
Dimensions: mm
1.5 MAX
4.5 MAX
0.25
0.2
0.1
5.5 MAX
6.5 MAX
APPLICATIONS
To drive IGBT modules for inverter or AC servo systems application
BLOCK DIAGRAM
VI + 14
RESET
DETECT
CIRCUIT
4 VCC
2 Ctrip
1 DETECT
VI - 13
INTERFACE
OPTO-COUPLER
270 ohm
GATE SHUT-
DOWN CIRCUIT
5 VO
8 FAULT OUTPUT
6 VEE
3,7,9,10 pin : NC

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VLA531-01R pdf
HYBRID IC
VLA531-01R
Hybrid IC for driving IGBT modules
FOR SAFETY USING
Great detail and careful attention are given to the production activity of Hics, such as the development, the quality of production, and
in it’s reliability. However the reliability of Hics depends not only on their own factors but also in their condition of usage. When
handling Hics, please note the following cautions.
CAUTIONS
Packing
Carrying
Storage
Extended storage
Maximum ratings
Polarity
The materials used in packing Hics can only withstand normal external conditions.
When exposed to outside shocks, rain and certain environmental contaminators, the packing materials
will deteriorates. Please take care in handling.
1) Don’t stack boxes too high. Avoid placing heavy materials on boxes.
2) Boxes must be positioned correctly during transportation to avoid breakage.
3) Don't throw or drop boxes.
4) Keep boxes dry. Avoid rain or snow.
5) Minimal vibration and shock during transportation is desirable.
When storing Hics, please observe the following notices or possible deterioration of their electrical
characteristics, risk of solder ability, and external damage may occur.
1) Devices must be stored where fluctuation of temperature and humidity is minimal, and must not
be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius with
humidity at 40 to 60%.
2) Avoid locations where corrosive gasses are generated or where much dust accumulates.
3) Storage cases must be static proof.
4) Avoid putting weight on boxes.
When extended storage is necessary, Hics must be kept non-processed. When using Hics which
have been stored for more than one year or under severe conditions, be sure to check that the exterior
is free from flaw and other damages.
To prevent any electrical damages, use Hics within the maximum ratings. The temperature, current,
voltage, etc. must not exceed these conditions.
To protect Hics from destruction and deterioration due to wrong insertion, make sure of polarity in
inserting leads into the board holes, conforming to the external view for the terminal arrangement.
5

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