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MC54HC563 Schematic ( PDF Datasheet ) - Motorola Semiconductors

Teilenummer MC54HC563
Beschreibung Octal 3-State Inverting Transparent Latch
Hersteller Motorola Semiconductors
Logo Motorola Semiconductors Logo 




Gesamt 7 Seiten
MC54HC563 Datasheet, Funktion
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Octal 3-State Inverting
Transparent Latch
High–Performance Silicon–Gate CMOS
The MC54/74HC563 is identical in pinout to the LS563. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
This device is identical in function to the HC533 but has the Data Inputs on
the opposite side of the package from the outputs to facilitate PC board
layout.
These latches appear transparent to data (i.e., the outputs change
asynchronously) when Latch Enable is high. The data appears at the outputs
in inverted form. When Latch Enable goes low, data meeting the setup and
hold time becomes latched.
The Output Enable input does not affect the state of the latches, but when
Output Enable is high, all device outputs are forced to the high–impedance
state. Thus, data may be latched even when the outputs are not enabled.
The HC573 is the noninverting version of this function.
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 202 FETs or 50.5 Equivalent Gates
LOGIC DIAGRAM
D0 2
D1 3
D2 4
DATA D3 5
INPUTS D4 6
D5 7
D6 8
D7 9
LATCH
ENABLE
OUTPUT
ENABLE
11
1
19
Q0
18 Q1
17 Q2
16 Q3
15 Q4
14 Q5
13 Q6
12 Q7
INVERTING
OUTPUTS
PIN 20 = VCC
PIN 10 = GND
MC54/74HC563
20
1
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
20
1
20
1
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
DW SUFFIX
SOIC PACKAGE
CASE 751D–04
ORDERING INFORMATION
MC54HCXXXJ
MC74HCXXXN
MC74HCXXXDW
Ceramic
Plastic
SOIC
PIN ASSIGNMENT
OUTPUT
ENABLE
1
D0 2
20 VCC
19 Q0
D1 3
18 Q1
D2 4
17 Q2
D3 5
16 Q3
D4 6
15 Q4
D5 7
14 Q5
D6 8
13 Q6
D7 9
GND 10
12 Q7
11 LATCH
ENABLE
FUNCTION TABLE
Inputs
Output
Output Latch
Enable Enable D
Q
L HH L
L HL H
L L X No Change
H XX Z
X = don’t care
Z = high impedance
10/95
© Motorola, Inc. 1995
1 REV 6






MC54HC563 Datasheet, Funktion
MC54/74HC563
20
1
A
F
H
D
SEATING
PLANE
–A–
20
1
–T–
SEATING
PLANE
E
GF
11
10
B
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 732–03
ISSUE E
CL
N
K
G
J
M
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 23.88 25.15 0.940 0.990
B 6.60 7.49 0.260 0.295
C 3.81 5.08 0.150 0.200
D 0.38 0.56 0.015 0.022
F 1.40 1.65 0.055 0.065
G 2.54 BSC
0.100 BSC
H 0.51 1.27 0.020 0.050
J 0.20 0.30 0.008 0.012
K 3.18 4.06 0.125 0.160
L 7.62 BSC
0.300 BSC
M 0_ 15_ 0_ 15_
N 0.25 1.02 0.010 0.040
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
11 ISSUE E
B
10
CL
K
N
D 20 PL
0.25 (0.010) M T A M
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E 0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
DW SUFFIX
–A–
20 11
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
–B– 10X P
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
0.010 (0.25) M B M
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
1 10
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
20X D
0.010 (0.25) M T A S B S
J
F
18X G
C
–T–
SEATING
PLANE
K
M
R X 45_
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G 1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
MOTOROLA
6 High–Speed CMOS Logic Data
DL129 — Rev 6

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