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Número de pieza PF0200
Descripción 12 channel configurable power management integrated circuit
Fabricantes NXP Semiconductors 
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NXP Semiconductors
Data Sheet: Advance Information
12 channel configurable power
management integrated circuit
Document Number: MMPF0200
Rev. 6.0, 8/2016
PF0200
The PF0200 Power Management Integrated Circuit (PMIC) provides a highly
programmable/ configurable architecture, with fully integrated power devices
and minimal external components. With up to four buck converters, one boost
regulator, six linear regulators, RTC supply, and coin-cell charger, the PF0200
can provide power for a complete system, including applications processors,
memory, and system peripherals, in a wide range of applications. With on-chip
One Time Programmable (OTP) memory, the PF0200 is available in pre-
programmed standard versions, or non-programmed to support custom
programming. The PF0200 is especially suited to the i.MX 6SoloLite,
i.MX 6Solo and i.MX 6DualLite versions of the i.MX 6 family of devices and is
supported by full system level reference designs, and pre-programmed
versions of the device. This device is powered by SMARTMOS technology.
Features:
• Three to four buck converters, depending on configuration
• Boost regulator to 5.0 V output
• Six general purpose linear regulators
• Programmable output voltage, sequence, and timing
• OTP (One Time Programmable) memory for device configuration
• Coin cell charger and RTC supply
• DDR termination reference voltage
• Power control logic with processor interface and event detection
• I2C control
• Individually programmable ON, OFF, and Standby modes
POWER MANAGEMENT
EP SUFFIX (E-TYPE)
56 QFN 8X8
98ASA00405D
ES SUFFIX (WF-TYPE)
56 QFN 8X8
98ASA00589D
Applications
• Tablets
• IPTV
• Industrial Control
• Medical monitoring
• Home automation/ alarm/ energy management
PF0200
VREFDDR
SW3A/B
SW1A/B
SW2
SWBST
Control Signals
I2C Communication
VGEN1
VGEN2
VGEN3
VGEN4
LICELL
Charger
VGEN5
VGEN6
DDR Memory
SD-MMC/
NAND Mem.
SATA
HDD
WAM
GPS
MIPI
LDVS Display
i.MX6X
DDR MEMORY
INTERFACE
Processor Core
Voltages
SATA - FLASH
NAND - NOR
Interfaces
Parallel control/GPIOS
I2C Communication
Camera
GPS
MIPI
uPCIe
HDMI
USB
Ethernet
CAN
External AMP
Microphones
Speakers
Audio
Codec
Sensors
Camera
COINCELL
Main Supply
Cluster/HUD
Front USB
POD
Rear Seat
Infotaiment
Figure 1. Simplified application diagram
Rear USB
POD
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© 2016 NXP B.V.

1 page




PF0200 pdf
3 Pin connections
3.1 Pinout diagram
PIN CONNECTIONS
56 55 54 53 52 51 50 49 48 47 46 45 44 43
INTB 1
42
SDWNB 2
41
RESETBMCU 3
40
STANDBY 4
39
ICTEST 5
38
SW1FB 6
37
SW1AIN 7
SW1ALX 8
EP 36
35
SW1BLX 9
34
SW1BIN 10
33
RSVD1 11
32
RSVD2 12
31
RSVD3 13
30
SW1VSSSNS 14
29
15 16 17 18 19 20 21 22 23 24 25 26 27 28
LICELL
VGEN6
VIN3
VGEN5
SW3AFB
SW3AIN
SW3ALX
SW3BLX
SW3BIN
SW3BFB
SW3VSSSNS
VREFDDR
VINREFDDR
VHALF
Figure 3. Pinout diagram
NXP Semiconductors
PF0200
5

5 Page





PF0200 arduino
GENERAL PRODUCT CHARACTERISTICS
Table 5. Thermal protection thresholds
Parameter
Thermal 110 °C Threshold (THERM110)
Thermal 120 °C Threshold (THERM120)
Thermal 125 °C Threshold (THERM125)
Thermal 130 °C Threshold (THERM130)
Thermal Warning Hysteresis
Thermal Protection Threshold
4.3 Electrical characteristics
Min.
100
110
115
120
2.0
130
Typ.
110
120
125
130
140
Max.
120
130
135
140
4.0
150
Units
°C
°C
°C
°C
°C
°C
Notes
4.3.1 General specifications
Table 6. General PMIC static characteristics
Consumer TA = -40 to 85 °C and Extended Industrial TA = -40 to 105 °C, VIN = 2.8 to 4.5 V, VDDIO = 1.7 to 3.6 V, typical external
component values and full load current range, unless otherwise noted.
Pin name
Parameter
Load condition
Min.
Max.
Unit
PWRON
RESETBMCU
SCL
SDA
INTB
SDWNB
STANDBY
VDDOTP
VIL
VIH
VOL
VOH
VIL
VIH
VIL
VIH
VOL
VOH
VOL
VOH
VOL
VOH
VIL
VIH
VIL
VIH
-2.0 mA
Open Drain
-2.0 mA
Open Drain
-2.0 mA
Open Drain
-2.0 mA
Open Drain
0.0
0.8 * VSNVS
0.0
0.7* VIN
0.0
0.8 * VDDIO
0.0
0.8 * VDDIO
0.0
0.7*VDDIO
0.0
0.7* VIN
0.0
0.7* VIN
0.0
0.8 * VSNVS
0.0
1.1
0.2 * VSNVS
3.6
0.4
VIN
0.2 * VDDIO
3.6
0.2 * VDDIO
3.6
0.4
VDDIO
0.4
VIN
0.4
VIN
0.2 * VSNVS
3.6
0.3
1.7
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
NXP Semiconductors
PF0200
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