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PDF MCP14A0151 Data sheet ( Hoja de datos )
| Número de pieza | MCP14A0151 | |
| Descripción | 1.5A MOSFET Driver | |
| Fabricantes | Microchip | |
| Logotipo |  |
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MCP14A0151/2
1.5A MOSFET Driver
with Low Threshold Input And Enable
Features
• High Peak Output Current: 1.5A (typical)
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• High Capacitive Load Drive Capability:
- 1000 pF in 11.5 ns (typical)
• Short Delay Times: 33 ns (tD1), 24 ns (tD2) (typical)
• Low Supply Current: 375 µA (typical)
• Low-Voltage Threshold Input and Enable with
Hysteresis
• Latch-Up Protected: Withstands 500 mA Reverse
Current
• Space-Saving Packages:
- 6L SOT-23
- 6L 2 x 2 DFN
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
• Level Translator
• Motor and Solenoid Drive
Package Types
6-Lead SOT-23
VDD 1
AGND 2
IN 3
MCP14A0151
MCP14A0152
6 OUT
OUT
5 GND
4 EN
* Includes Exposed Thermal Pad (EP); see Table 3-1.
General Description
The MCP14A0151/2 devices are high-speed MOSFET
drivers that are capable of providing up to 1.5A of peak
current while operating from a single 4.5V to 18V
supply. The inverting (MCP14A0151) or non-inverting
(MCP14A0152) single channel output is directly
controlled from either TTL or CMOS (2V to 18V) logic.
These devices also feature low shoot-through current,
matched rise and fall times, and short propagation
delays which make them ideal for high switching
frequency applications.
The MCP14A0151/2 family of devices offer enhanced
control with Enable functionality. The active-high
Enable pin can be driven low to drive the output of the
MCP14A0151/2 low, regardless of the status of the
Input pin. An integrated pull-up resistor allows the user
to leave the Enable pin floating for standard operation.
Additionally, the MCP14A0151/2 devices feature sepa-
rate ground pins (AGND and GND), allowing greater
noise isolation between the level-sensitive Input/
Enable pins and the fast, high-current transitions of the
push-pull output stage.
These devices are highly latch-up resistant under any
condition within their power and voltage ratings. They
can accept up to 500 mA of reverse current being
forced back into their outputs without damage or logic
upset. All terminals are fully protected against
electrostatic discharge (ESD) up to 1.75 kV (HBM) and
200V (MM).
MCP14A0151
MCP14A0152
OUT
OUT 1
GND 2
EP
7
EN 3
2x2 DFN-6*
6 VDD
5 IN
4 AGND
2014 Microchip Technology Inc.
DS20005368A-page 1
1 page  
MCP14A0151/2
DC CHARACTERISTICS (OVER OPERATING TEMP. RANGE) (Note 1) (CONTINUED)
Electrical Specifications: Unless otherwise indicated, over the operating range with 4.5V VDD 18V.
Parameters
Sym.
Min. Typ. Max. Units
Conditions
Switching Time (Note 1)
Rise Time
Fall Time
Delay Time
tR
tF
tD1
tD2
— 14 21 ns VDD = 18V, CL = 1000 pF,
TA = +125°C, see Figure 4-1,
Figure 4-2
— 13 20 ns VDD = 18V, CL = 1000 pF,
TA = +125°C, see Figure 4-1,
Figure 4-2
— 31 38 ns VDD = 18V, VIN = 5V, TA = +125°C,
see Figure 4-1, Figure 4-2
— 26 33
VDD = 18V, VIN = 5V, TA = +125°C,
see Figure 4-1, Figure 4-2
Power Supply
Supply Voltage
VDD 4.5 — 18
IDD — — 760
Power Supply Current
IDD — — 780
IDD — — 780
IDD — — 800
Note 1: Tested during characterization, not production tested.
V
uA VIN = 3V, VEN = 3V
uA VIN = 0V, VEN = 3V
uA VIN = 3V, VEN = 0V
uA VIN = 0V, VEN = 0V
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V
Parameter
Sym. Min. Typ. Max. Units
Comments
Temperature Ranges
Specified Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 6LD 2x2 DFN
Thermal Resistance, 6LD SOT-23
TA
TJ
TA
JA
JA
-40
—
-65
—
—
—
+125
°C
—
+150
°C
—
+150
°C
91 — °C/W
192 — °C/W
2014 Microchip Technology Inc.
DS20005368A-page 5
5 Page 
MCP14A0151/2
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin No.
6L 2x2 DFN
1
2
3
4
5
6
EP
6L SOT-23
6
5
4
2
3
1
—
Symbol
OUT/OUT
GND
EN
AGND
IN
VDD
EP
Description
Push-Pull Output
Power Ground
Device Enable
Analog Ground
Control Input
Supply Input
Exposed Thermal Pad (GND)
3.1 Output Pin (OUT, OUT)
The Output is a CMOS push-pull output that is capable
of sourcing and sinking 1.5A of peak current
(VDD = 18V). The low output impedance ensures the
gate of the external MOSFET stays in the intended
state even during large transients. This output also has
a reverse current latch-up rating of 500 mA.
3.2 Power Ground Pin (GND)
GND is the device return pin for the output stage. The
GND pin should have a low-impedance connection to
the bias supply source return. When the capacitive load
is being discharged, high peak currents will flow out of
the ground pin.
3.3 Device Enable Pin (EN)
The MOSFET driver Device Enable is a high-
impedance, TTL/CMOS compatible input. The Enable
input also has hysteresis between the high and low
input levels, allowing them to be driven from slow rising
and falling signals and to provide noise immunity.
Driving the Enable pin below the threshold will disable
the output of the device, pulling OUT/OUT low,
regardless of the status of the Input pin. Driving the
Enable pin above the threshold allows normal
operation of the OUT/OUT pin based on the status of
the Input pin. The Enable pin utilizes an internal pull up
resistor, allowing the pin to be left floating for standard
driver operation.
3.5 Control Input Pin (IN)
The MOSFET driver Control Input is a high-impedance,
TTL/CMOS compatible input. The Input also has
hysteresis between the high and low input levels,
allowing them to be driven from slow rising and falling
signals and to provide noise immunity.
3.6 Supply Input Pin (VDD)
VDD is the bias supply input for the MOSFET driver and
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local capacitor. This bypass
capacitor provides a localized low-impedance path for
the peak currents that are provided to the load
3.7 Exposed Metal Pad Pin (EP)
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane, or other cop-
per plane on a printed circuit board, to aid in heat
removal from the package.
3.4 Analog Ground Pin (AGND)
AGND is the device return pin for the input and enable
stages of the MOSFET driver. The AGND pin should be
connected to an electrically “quiet” ground node to pro-
vide a low noise reference for the input and enable
pins.
2014 Microchip Technology Inc.
DS20005368A-page 11
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet MCP14A0151.PDF ] | |
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