Datenblatt-pdf.com


908E624 Schematic ( PDF Datasheet ) - Freescale Semiconductor

Teilenummer 908E624
Beschreibung Integrated Triple High Side Switch
Hersteller Freescale Semiconductor
Logo Freescale Semiconductor Logo 




Gesamt 30 Seiten
908E624 Datasheet, Funktion
Freescale Semiconductor
Technical Data
Document Number: MM908E624
Rev. 11.0, 4/2012
Integrated Triple High Side
Switch with Embedded MCU
and LIN Serial Communication
for Relay Drivers
The 908E624 is an integrated single-package solution that
includes a high performance HC08 microcontroller with a
SMARTMOS analog control IC. The HC08 includes flash memory, a
timer, enhanced serial communications interface (ESCI), an analog-
to-digital converter (ADC), internal serial peripheral interface (SPI),
and an internal clock generator module. The analog control die
provides three high side outputs with diagnostic functions, voltage
regulator, watchdog, current sense operational amplifier, and local
interconnect network (LIN) physical layer.
The single package solution, together with LIN, provides optimal
application performance adjustments and space saving PCB design.
It is well-suited for the control of automotive high current motors
applications using relays (e.g., window lifts, fans, and sun roofs).
Features
• High performance M68HC908EY16 core
• 16 KB of on-chip flash memory, 512 B of RAM
• Internal clock generator module
• Two 16-bit, two-channel timers
• 10-bit ADC
• LIN physical layer interface
• Low dropout voltage regulator
• Three high side outputs
• Two wake-up inputs
• 16 microcontroller I/Os
908E624
908E624
HIGH SIDE SWITCH
EW (Pb-FREE) SUFFIX
98ASA99294D
54-pin SOICW
ORDERING INFORMATION
Device
(Add an R2 suffix for Tape
and reel orders)
Temperature
Range (TA)
Package
MM908E624ACPEW
MM908E624AYPEW
-40°C to 85°C
-40°C to 125°C
54 SOICW
LIN Interface
5.0 V
Microcontroller
Ports
LIN
VREFH
VDDA
EVDD
VCC
VDD
VREFL
VSSA
EVSS
AGND
GND
VSP1
RXD
PTE1/RXD
RST
RST_A
IRQ
IRQ_A
PTD0/TACH0
PW/MIN
PTA0-4
PTB1;3-7
PTC2-4
PTD1/TACH1
VSP
HS3
L1
L2
HS1
HS2
+E
WDCONF
OUT
-E
VBAT
M
To Microcontroller A/D Channel
Figure 1. 908E624 Simplified Application Diagram
*This document contains certain information on a product under development.
Freescale reserves the right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2012. All rights reserved.






908E624 Datasheet, Funktion
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
THERMAL RATINGS
Package Operating Ambient Temperature (4)
MM908E624ACPEW
MM908E624AYPEW
Operating Junction Temperature (2)(4)
MM908E624ACPEW
MM908E624AYPEW
TA °C
-40 to 85
-40 to 125
TJ °C
-40 to 125
-40 to 125
Storage Temperature
Peak Package Reflow Temperature During Reflow(3)(5)
TSTG
TPPRT
-40 to 150
Note 5
°C
°C
Notes
2. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
3. Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4. Independent of TA, device parametrics are only guaranteed for -40 < TJ < 125 °C. Please see note 2. TJ is a factor of power dissipation,
package thermal resistance, and available heat sinking.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
908E624
6
Analog Integrated Circuit Device Data
Freescale Semiconductor

6 Page









908E624 pdf, datenblatt
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. Dynamic Electrical Characteristics (continued)
All characteristics are for the analog chip only. Please refer to the 68HC908EY16 data sheet for characteristics of the
microcontroller chip. Characteristics noted under conditions 9.0 V VSUP 16 V, -40 °C TJ 125 °C, unless otherwise noted.
Typical values noted reflect the approximate parameter mean at TA = 25 °C under nominal conditions, unless otherwise noted.
Characteristic
Symbol Min Typ Max Unit
LIN PHYSICAL LAYER (CONTINUED)
Output Current Shutdown Delay
SPI INTERFACE TIMING
tOV-DELAY
10
μs
SPI Operating Recommended Frequency
L1 AND L2 INPUTS
f SPIOP
0.25
4.0 MHz
Wake-up Filter Time (24)
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
tWUF 8.0 20 38 μs
Watchdog Period
External Resistor REXT = 10 kΩ (1%)
External Resistor REXT = 100 kΩ (1%)
Without External Resistor REXT (WDCONF Pin Open)
t PWD
ms
— 10.558 —
— 99.748 —
97 150 205
STATE MACHINE TIMING
Reset Low Level Duration after VDD High (28)
Interrupt Low Level Duration
Normal Request Mode Timeout (28)
Delay Between SPI Command and HS1/HS2/HS3 Turn On (25), (26)
Delay Between SPI Command and HS1/HS2/HS3 Turn Off (25), (26)
Delay Between Normal Request and Normal Mode After W/D Trigger
Command (27)
t RST
0.65 1.0 1.35 ms
tINT 7.0 10 13 μs
t NRTOUT
97
150 205 ms
t S-HSON
3.0
10 μs
t S-HSOFF
3.0
10 μs
t S-NR2N
6.0
35
70 μs
Delay Between SS Wake-Up (SS LOW to HIGH) and Normal Request Mode
t W-SS
μs
(VDD On and Reset High)
15 40 80
Delay Between SS Wake-Up (SS LOW to HIGH) and First Accepted SPI
t W-SPI
μs
Command
90 — N/A
Delay Between Interrupt Pulse and First SPI Command Accepted
t S-1STSPI
30
— N/A
Minimum Time Between Two Rising Edges on SS
t 2SS
15 — —
Notes
24. This parameter is guaranteed by process monitoring but is not production tested.
25. Delay between turn-on or turn-off command and high side on or high side off, excluding rise or fall time due to external load.
26. Delay between the end of the SPI command (rising edge of the SS) and start of device activation/deactivation.
27. This parameter is guaranteed by process monitoring but it is not production tested.
28. Also see Figure 10 on page 15
μs
μs
908E624
12
Analog Integrated Circuit Device Data
Freescale Semiconductor

12 Page





SeitenGesamt 30 Seiten
PDF Download[ 908E624 Schematic.PDF ]

Link teilen




Besondere Datenblatt

TeilenummerBeschreibungHersteller
908E621Integrated Quad Half-Bridge and Triple High-SideFreescale Semiconductor
Freescale Semiconductor
908E622Triple High-Side and EC Glass DriverFreescale Semiconductor
Freescale Semiconductor
908E624Integrated Triple High Side SwitchMotorola  Inc
Motorola Inc
908E624Integrated Triple High Side SwitchFreescale Semiconductor
Freescale Semiconductor
908E625Integrated Quad Half H-BridgeFreescale Semiconductor
Freescale Semiconductor

TeilenummerBeschreibungHersteller
CD40175BC

Hex D-Type Flip-Flop / Quad D-Type Flip-Flop.

Fairchild Semiconductor
Fairchild Semiconductor
KTD1146

EPITAXIAL PLANAR NPN TRANSISTOR.

KEC
KEC


www.Datenblatt-PDF.com       |      2020       |      Kontakt     |      Suche