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HWD2111 Schematic ( PDF Datasheet ) - CSMSC

Teilenummer HWD2111
Beschreibung Dual 105mW Headphone Amplifier
Hersteller CSMSC
Logo CSMSC Logo 




Gesamt 19 Seiten
HWD2111 Datasheet, Funktion
HWD2111
Dual 105mW Headphone Amplifier with Digital Volume
Control and Shutdown Mode
General Description
Key Specifications
The HWD2111 is a dual audio power amplifier capable of n THD+N at 1kHz, 105mW continuous average output
delivering 105mW per channel of continuous average power
power into 16
0.1% (typ)
into a 16load with 0.1% (THD+N) from a 5V power supply. n THD+N at 1kHz, 70mW continuous average power into
audio power amplifiers were designed specifically to
32
0.1% (typ)
provide high quality output power with a minimal amount of n Shutdown Current
external components. Since the HWD2111 does not require
0.3µA (typ)
bootstrap capacitors or snubber networks, it is optimally Features
suited for low-power portable systems.
n Digital volume control range from +12dB to −33dB
The HWD2111 features a digital volume control that sets the n LD and MSOP surface mount packaging
amplifier’s gain from +12dB to −33dB in 16 discrete steps
using a two−wire interface.
The unity-gain stable HWD2111 also features an externally
controlled, active-high, micropower consumption shutdown
n
n
n
"Click and Pop" suppression circuitry
No bootstrap capacitors required
Low shutdown current
mode. It also has an internal thermal shutdown protection
mechanism.
Applications
n Cellular Phones
n MP3, CD, DVD players
n PDA’s
n Portable electronics
Connection Diagrams
MSOP Package
LD Package
Top View
Order Number HWD2111MM
Top View
Order Number HWD2111LD
1






HWD2111 Datasheet, Funktion
Typical Performance Characteristics (Continued)
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
7

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HWD2111 pdf, datenblatt
Application Information (Continued)
POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a
successful design. Equation 1 states the maximum power
dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
PDMAX = (VDD) 2 / (2π2RL)
(1)
Since the HWD2111 has two operational amplifiers in one
package, the maximum internal power dissipation point is
twice that of the number which results from Equation 1. Even
with the large internal power dissipation, the HWD2111 does
not require heat sinking over a large range of ambient tem-
perature. From Equation 1, assuming a 5V power supply and
a 32load, the maximum power dissipation point is 40mW
per amplifier. Thus the maximum package dissipation point
is 80mW. The maximum power dissipation point obtained
must not be greater than the power dissipation predicted by
Equation 2:
PDMAX = (TJMAX − TA) / θJA
(2)
For the MSOP package, θJA = 194˚C/W, and for the LD
package, θJA = 63˚C/W. TJMAX = 150˚C for the HWD2111. For
a given ambient temperature, TA, of the system surround-
ings, Equation 2 can be used to find the maximum internal
power dissipation supported by the IC packaging. If the
result of Equation 1 is greater than that of Equation 2, then
either the supply voltage must be decreased, the load im-
pedance increased, or TA reduced. For the MSOP package
in a typical application of a 5V power supply and a 32load,
the maximum ambient temperature possible without violating
the maximum junction temperature is approximately
134.5˚C. This assumes the device operates at maximum
power dissipation and uses surface mount packaging. Inter-
nal power dissipation is a function of output power. If typical
operation is not around the maximum power dissipation
point, operation at higher ambient temperatures is possible.
Refer to the Typical Performance Characteristics curves
for power dissipation information for lower output power
levels.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
The HWD2111’s exposed-dap (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air.
The LD package should have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad may be con-
nected to a large plane of continuous unbroken copper. This
plane forms a thermal mass, heat sink, and radiation area.
However, since the HWD2111 is designed for headphone ap-
plications, connecting a copper plane to the DAP’s PCB
copper pad is not required. The HWD2111’s Power Dissipation
vs Output Power Curve in the Typical Performance Char-
acteristics shows that the maximum power dissipated is just
45mW per amplifier with a 5V power supply and a 32load.
Further detailed and specific information concerning PCB
layout, fabrication, and mounting an LD (LLP) package is
available fromCSMSC Semiconductor’s Package Engineer-
ing Group under application note AN1187.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and
power supply pins should be as close to the device as
possible. The value of the bypass capacitor directly affects
the HWD2111’s half-supply voltage stability and PSRR. The
stability and supply rejection increase as the bypass capaci-
tor’s value increases. Typical applications employ a 5V regu-
lator with 10µF and a 0.1µF bypass capacitors which aid in
supply stability, but do not eliminate the need for bypassing
the supply nodes of the HWD2111. The selection of bypass
capacitors, especially CB, is thus dependent upon desired
low frequency PSRR, click and pop performance, (explained
in the section, Proper Selection of External Components),
system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not is use, the
HWD2111 features amplifier bias circuitry shutdown. This shut-
down function is activated by applying a logic high to the
SHUTDOWN pin. The trigger point is 1.4V minimum for a
logic high level, and 0.4V maximum for a logic low level. It is
best to switch between ground and VDD to ensure optimal
shutdown operation. By switching the SHUTDOWN pin to
VDD, the HWD2111 supply current draw will be minimized in
idle mode. Whereas the device will be disabled with shut-
down voltages less than VDD, the idle current may be greater
than the typical value of 0.3µA. In either case, the SHUT-
DOWN pin should be tied to a fixed voltage to avoid un-
wanted state changes.
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry. This provides
a quick, smooth shutdown transition. Another solution is to
use a single-pole, single-throw switch in conjunction with an
external pull-up resistor. When the switch is closed, the
SHUTDOWN pin is connected to ground and enables the
amplifier. If the switch is open, the external pull-up resistor,
RPU, will disable the HWD2111. This scheme guarantees that
the SHUTDOWN pin will not float, thus preventing unwanted
state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Selection of external components when using integrated
power amplifiers is critical for optimum device and system
performance. While the HWD2111 is tolerant of external com-
ponent combinations, consideration must be given to the
external component values that maximize overall system
quality.
The HWD2111’s unity-gain stability allows a designer to maxi-
mize system performance. Low gain settings maximize
signal-to-noise performance and minimizes THD+N. Low
gain configurations require large input signals to obtain a
given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs.
Please refer to the section, Audio Power Amplifier Design,
for a more complete explanation of proper gain selection.
12

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