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IX4426 Schematic ( PDF Datasheet ) - IXYS

Teilenummer IX4426
Beschreibung 1.5-Ampere Dual Low-Side Ultrafast MOSFET Drivers
Hersteller IXYS
Logo IXYS Logo 




Gesamt 13 Seiten
IX4426 Datasheet, Funktion
INTEGRATED CIRCUITS DIVISION
Features
1.5A Peak Output Current
Wide Operating Voltage Range: 4.5V to 35V
-40°C to +125°C Operating Temperature Range
Latch-up Protected to 1.5A
TTL and CMOS Compatible Inputs
Fast Rise and Fall Times
Low Power Consumption
Applications
MOSFET Driver
Switching Power Supplies
Motor Controls
DC to DC Converters
Pulse Transformer Driver
IX4426-IX4427-IX4428
1.5-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
Description
The IX4426, IX4427, and IX4428 are dual high-speed,
low-side gate drivers. Each of the two outputs can
source and sink 1.5A of peak current with rise and fall
times of less than 10ns. The inputs of each driver are
TTL and CMOS compatible, and are virtually immune
to latch-up. Low propagation delay times and fast,
matched rise and fall times make the IX4426, IX4427,
and IX4428 ideal for high-frequency and high-power
applications.
The IX4426 is configured as a dual inverting driver;
the IX4427 is configured as a dual non-inverting
driver; and the IX4428 is configured with one inverting
driver and one non-inverting driver. All three devices
are available in a standard 8-pin SOIC package (N
suffix) and an 8-pin DFN package (M suffix).
Ordering Information
Logic Configuration
INA A
OUTA
Part Number
IX4426N
IX4426NTR
INB B
OUTB
IX4426MTR
INA A
INB B
OUTA
IX4427N
IX4427NTR
OUTB IX4427MTR
INA A
INB B
IX4428N
OUTA
IX4428NTR
OUTB IX4428MTR
Package Type
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
8-Pin SOIC
8-Pin SOIC
8-Pin DFN
Packing Method
Tube
Tape & Reel
Tape & Reel
Tube
Tape & Reel
Tape & Reel
Tube
Tape & Reel
Tape & Reel
Quantity
100
2000
2000
100
2000
2000
100
2000
2000
DS-IX4426-27-28_R05
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1






IX4426 Datasheet, Funktion
INTEGRATED CIRCUITS DIVISION
IX4426-27-28
1.7 Thermal Characteristics
Package
8-Pin SOIC
8-Pin DFN
Parameter
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Ambient
2 IX4426-27-28 Performance
Symbol
JA
JA
Rating
120
68
Units
°C/W
°C/W
2.1 Timing Diagrams
V
IH
INx VIL
90%
OUTx
10%
ton
toff
tR tF
Non-Inverting Driver Waveforms
V
IH
INx VIL
toff ton
90%
OUTx
10%
tF
tR
Inverting Driver Waveforms
2.2 Characteristics Test Diagram
0.1μF 10μF
+
VCC
-
VIN
V
CC
INA OUTA
INB OUTB
GND
Tektronix
Current Probe
1000pF
6302
Tektronix
1000pF Current Probe
6302
6
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IX4426 pdf, datenblatt
INTEGRATED CIRCUITS DIVISION
IX4426-27-28
5.4 Mechanical Dimensions
5.4.1 “N” Package (8-Pin SOIC)
Pin 8
1.27 REF
6.00 ± 0.20
3.90 ± 0.10
0.40 min
1.27 max
PCB Land Pattern
0.65
Pin 1
0.42 ± 0.09
1.75
5.60
4.90 ± 0.10
1.25 min
1.75 max
0.175 ± 0.075
5.4.2 “N” Package Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
B0=5.30
(0.209)
1.27
NOTES:
1. Complies with JEDEC Standard MS-012.
2. All dimensions are in millimeters.
3. Dimensions do not include mold flash or burrs
W=12.00
(0.472)
Embossed Carrier
K0= 2.10
(0.083)
A0=6.50
(0.256)
P=8.00
(0.315)
User Direction of Feed
Dimensions
mm
(inches)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
12
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12 Page





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