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Teilenummer | IX2127 |
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Beschreibung | High-Voltage Power MOSFET & IGBT Driver | |
Hersteller | IXYS | |
Logo | ||
Gesamt 13 Seiten INTEGRATED CIRCUITS DIVISION
IX2127
High-Voltage
Power MOSFET & IGBT Driver
Driver Characteristics
Parameter
Rating
VOFFSET
IO +/- (Source/Sink)
VCSth
tON / tOFF (Typical)
600
250/500
250
100
Units
V
mA
mV
ns
Features
• Floating Channel Designed for Bootstrap Operation
up to 600V
• Tolerant to Negative Transient Voltages; dV/dt
Immune
• Undervoltage Lockout
• 3.3V, 5V, and 12V Input Logic Compatible
• Open-Drain FAULT Indicator Pin Shows
Over-Current Shutdown
• Output in Phase with the Input
Applications
• High-Speed Gate Driver
• Motor Drive Inverter
Pb e3
IX2127 Block Diagram
Description
The IX2127 is a high-voltage, high-speed power
MOSFET and IGBT driver. High-voltage level-shift
circuitry enables this device to operate up to 600V.
IXYS Integrated Circuits Division’s proprietary
common-mode design techniques provide stable
operation in high dV/dt noise environments.
An on-board comparator can be used to detect an
over-current condition in the driven MOSFET or IGBT
device, and then shut down drive to that device. An
open-drain output, FAULT, indicates that an
over-current shutdown has occurred.
The gate driver output typically can source 250mA
and sink 500mA, which is suitable for fluorescent lamp
ballast, motor control, SMPS, and other converter
drive topologies.
The IX2127 is provided in 8-pin DIP and 8-pin SOIC
packages, and is available in Tape & Reel versions.
See ordering information below.
Ordering Information
Part
IX2127G
IX2127N
IX2127NTR
Description
8-Pin DIP (50/Tube)
8-Pin SOIC (100/Tube)
8-Pin SOIC (2000/Reel)
VCC
IN
FAULT
COM
VCC Low Side High Side
Data Latch
Enable
Transmitter
Low-High
Level Shift
Receiver
Undervoltage Lockout
Buffer
Blanking
Signal
Delay
QR
S
Receiver
High-Low
Level Shift
Transmitter
Enable
Data Latch
+
_
Comparator
VB
HO
VS
CS
DS-IX2127-R03
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1
INTEGRATED CIRCUITS DIVISION
1.7 Timing Characteristics
Parameter
Turn-On Propagation Delay
Turn-Off Propagation Delay
Turn-On Rise Time
Turn-Off Fall Time
Start-Up Blanking Delay
CS Shutdown Propagation Delay
CS to FLT Propagation Delay
Conditions
VCC=VBS=12V,
CL=1nF,
TA=25°C
Figure 1. Typical Connection Diagram
IX2127
Symbol
ton
toff
tr
tf
tblk
tCS
tFLT
Minimum
-
-
-
-
550
-
-
Typical
100
73
23
20
766
220
236
Maximum Units
200
200
130
65 ns
950
360
510
VCC
IN
FAULT
1 VCC
2 IN
3 FAULT
4 COM
VB 8
HO 7
CS 6
VS 5
RGATE
6
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R03
6 Page INTEGRATED CIRCUITS DIVISION
IX2127
3.5 Mechanical Dimensions
3.5.1 8-Pin DIP Through-Hole Package
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
9.144 ± 0.508
(0.360 ± 0.020)
Pin 1
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 ± 0.0127
(0.010 ± 0.0005)
PCB Hole Pattern
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.813 ± 0.102
(0.032 ± 0.004)
3.5.2 8-Pin SOIC Package
Pin 8
1.270 REF
(0.050)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.346 ± 0.076
(0.053 ± 0.003)
0.762 ± 0.254
(0.030 ± 0.010)
0.559 ± 0.254
(0.022 ± 0.010)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
Dimensions
mm
(inches)
PCB Land Pattern
0.60
(0.024)
5.40
(0.213)
1.55
(0.061)
1.27
(0.050)
Dimensions
mm
(inches)
12
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R03
12 Page | ||
Seiten | Gesamt 13 Seiten | |
PDF Download | [ IX2127 Schematic.PDF ] |
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