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AR0237 Schematic ( PDF Datasheet ) - ON Semiconductor

Teilenummer AR0237
Beschreibung 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Hersteller ON Semiconductor
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Gesamt 30 Seiten
AR0237 Datasheet, Funktion
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Features
1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
AR0237/D, Rev. 3
For the latest datasheet, please visit www.onsemi.com
Features
• Superior low-light performance
• Latest 3.0 m pixel with ON Semiconductor
DR-Pix™ technology with Dual Conversion Gain
• Full HD support at up to 1080P 60 fps for superior
video performance
• Linear or high dynamic range capture
• Supports line interleaved T1/T2 readout to enable
HDR processing in ISP chip
• Support for external mechanical shutter
• On-chip phase-locked loop (PLL) oscillator
• Integrated position-based color and lens shading
correction
• Slave mode for precise frame-rate control
• Stereo/3D camera support
• Statistics engine
• Data interfaces: four-lane serial high-speed pixel
interface (HiSPi) differential signaling (SLVS and
HiVCM), or parallel
• Auto black level calibration
• High-speed configurable context switching
• Temperature sensor
Applications
• Video surveillance
• 1080p60 (Surveillance) video applications
• High dynamic range imaging
General Description
ON Semiconductor's AR0237 is a 1/2.7-inch CMOS
digital image sensor with an active-pixel array of
1928Hx1088V. It captures images in either linear or
high dynamic range modes, with a rolling-shutter
readout. It includes sophisticated camera functions
such as in-pixel binning, windowing and both video
and single frame modes. It is designed for both low
light and high dynamic range scene performance. It is
programmable through a simple two-wire serial inter-
face. The AR0237 produces extraordinarily clear, sharp
digital pictures, and its ability to capture both continu-
ous video and single frames makes it the perfect choice
for a wide range of applications, including surveillance
and HD video.
Table 1:
Key Parameters
Parameter
Typical Value
Optical format
1/2.7-inch (6.6 mm)
Active pixels
1928(H) x 1088(V) (16:9 mode)
Pixel size
3.0 m x 3.0m
Color filter array RGB Bayer
Shutter type
Electronic rolling shutter and GRR
Input clock range 6 – 48 MHz
Output clock
maximum
148.5 Mp/s (4-lane HiSPi)
74.25 Mp/s (Parallel)
Serial
Output
Parallel
HiSPi 10-, 12-, 14-, 16-, or 20-bit
10-, 12-bit
Frame
rate
1080p
60 fps Linear HiSPi
30 fps Linear Parallel
30 fps Line Interleaved HiSPi
15 fps Line Interleaved Parallel
Responsivity
4.0 V/lux-sec
SNRMAX
41 dB
Max Dynamic range Up to 96 dB
I/O 1.8 or 2.8 V
Supply Digital
voltage Analog
1.8 V
2.8 V
HiSPi
0.3 V - 0.6 V (SLVS), 1.7 V - 1.9 V (HiVcm)
Power consumption < 300mW Line interleaved 1080p30
(typical)
<190mW 1080p30 Linear Mode
Operating
temperature
–30°C to +85°C ambient
Package options
10x10 mm 80-pin iBGA
11.43x11.43 mm 48-pin mPLCC
AR0237CS/D Rev. 3, 3/16 EN
1 ©Semiconductor Components Industries, LLC 2016,






AR0237 Datasheet, Funktion
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
high dynamic range mode of operation where two images and taken using different
exposures. These images are output in from the sensor and the ISP must combine them
into one high dynamic range image.
Figure 2: Typical Configuration: Serial Four-Lane HiSPi Interface
Digital Digital
I/O Core
power1 power1
HiSPi
PLL Analog Analog
power1 power1 power1 power1
Master clock
(6–48 MHz)
From
controller
VDD_IO VDD
EXTCLK
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
RESET_BAR
TEST
DGND
VDD_PLL VAA VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SLVS3_P
SLVS3_N
SLVSC_P
SLVSC_N
FLASH
SHUTTER
AGND
VDD_IO
VDD VDD_SLVS VDD_PLL
VAA VAA_PIX
Digital
ground
Analog
ground
To
controller
Notes:
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. The parallel interface output pads can be left unconnected if the serial output interface is used.
4. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on lay-
out and design considerations. Refer to the AR0237 demo headboard schematics for circuit recom-
mendations.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that cou-
pling with the digital power planes is minimized.
6. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
AR0237CS/D Rev. 3, 3/16 EN
6 ©Semiconductor Components Industries, LLC, 2016.

6 Page









AR0237 pdf, datenblatt
Table 4: mPLCC HiSPi Pin Out
39 AGND
40 DGND
41 VDD
42 VDD_IO
43 VDD
44 SLSV3P
45 SLVS3N
46 SLVS2P
47 SLVS2N
48 SLVSLCP
AR0237CS: 1/2.7-Inch 2.1 Mp/Full HD Digital Image Sensor
Functional Overview
Power
Power
Power
Power
Power
Output
Output
Output
Output
Output
Analog Ground
Digital ground
Digital Power
I/O Power Supply
Digital Power
HiSPi serial data, lane 3, differential P
HiSPi serial data, lane 3, differential N
HiSPi serial data, lane 2, differential P
HiSPi serial data, lane 2, differential N
HiSPi serial DDR clock differential P
AR0237CS/D Rev. 3, 3/16 EN
12
©Semiconductor Components Industries, LLC, 2016.

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