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PDF CPC1726Y Data sheet ( Hoja de datos )
| Número de pieza | CPC1726Y | |
| Descripción | Normally Open DC Power SIP Relay | |
| Fabricantes | IXYS | |
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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
250
1
0.75
Units
VP
ADC
Features
• Handle Load Currents Up to 1ADC
• 2500Vrms Input/Output Isolation
• Power SIP Package
• High Reliability
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Flammability Rating UL 94 V-0
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
CPC1726
Single-Pole, Normally Open
DC Power SIP Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high power solid
state relays. As part of that family, the CPC1726 is
a normally open (1-Form-A) solid state relay. The
CPC1726 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capabilities makes the relay suitable for a variety of
high performance switching applications.
Approvals
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1172007
Ordering Information
Part #
Description
CPC1726Y 4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
DS-CPC1726-R04
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
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INTEGRATED CIRCUITS DIVISION
CPC1726
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1726Y
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
CPC1726Y
Classification Temperature (Tc)
245ºC
Dwell Time (tp)
30 seconds
Max Reflow Cycles
1
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
R04 www.ixysic.com
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1726Y.PDF ] | |
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