|
|
Teilenummer | NCP1612B |
|
Beschreibung | High-Efficiency Power Factor Controller | |
Hersteller | ON Semiconductor | |
Logo | ||
Gesamt 30 Seiten NCP1612A, NCP1612B,
NCP1612A1, NCP1612A2,
NCP1612A3, NCP1612B2
Enhanced, High‐Efficiency
Power Factor Controller
The NCP1612 is designed to drive PFC boost stages based on an
innovative Current Controlled Frequency Fold−back (CCFF)
method. In this mode, the circuit classically operates in Critical
conduction Mode (CrM) when the inductor current exceeds a
programmable value. When the current is below this preset level, the
NCP1612 linearly decays the frequency down to about 20 kHz when
the current is null. CCFF maximizes the efficiency at both nominal
and light load. In particular, the stand-by losses are reduced to a
minimum.
Like in FCCrM controllers, an internal circuitry allows near-unity
power factor even when the switching frequency is reduced. Housed in
a SO−10 package, the circuit also incorporates the features necessary
for robust and compact PFC stages, with few external components.
General Features
• Near-unity Power Factor
• Critical Conduction Mode (CrM)
• Current Controlled Frequency Fold-back (CCFF): Low Frequency
Operation is Forced at Low Current Levels
• On-time Modulation to Maintain a Proper Current Shaping in CCFF
Mode
• Skip Mode Near the Line Zero Crossing
• Fast Line/Load Transient Compensation
(Dynamic Response Enhancer)
• Valley Turn On
• High Drive Capability: −500 mA/+800 mA
• VCC Range: from 9.5 V to 35 V
• Low Start-up Consumption
• Six Versions: NCP1612A, B, A1, A2, A3 and B2 (see Table 1)
• Line Range Detection
• pfcOK Signal
• This is a Pb-Free Device
www.onsemi.com
SOIC−10
CASE 751BQ
MARKING DIAGRAM
10
1612x
ALYW
G
1
1612x
A
L
Y
W
G
= Specific Device Code
x = A, A1, A2, A3, B or B2
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
PIN CONNECTIONS
FOVP
Feedback
Vcontrol
Vsense
FFcontrol
1
(Top View)
pfcOK
VCC
DRV
GND
CS/ZCD
ORDERING INFORMATION
See detailed ordering and shipping information on page 32 of
this data sheet.
Safety Features
• Separate Pin for Fast Over-voltage Protection (FOVP)
for Redundancy
• Soft Over-voltage Protection
• Brown-out Detection
• Soft-start for Smooth Start-up Operation
(A, A1, A2 and A3 Versions)
• Over Current Limitation
• Disable Protection if the Feedback is Not Connected
• Thermal Shutdown
• Latched Off Capability
• Low Duty-cycle Operation if the Bypass Diode is
shorted
• Open Ground Pin Fault Monitoring
• Saturated Inductor Protection
• Detailed Safety Testing Analysis
(Refer to Application Note AND9079/D)
© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 9
1
Publication Order Number:
NCP1612/D
NCP1612A, NCP1612B, NCP1612A1, NCP1612A2, NCP1612A3, NCP1612B2
Table 3. TYPICAL ELECTRICAL CHARACTERISTICS (continued)
(Conditions: VCC = 15 V, TJ from −40°C to +125°C, unless otherwise specified)
Symbol
Rating
GATE DRIVE
VDRVlow
DRV pin level at VCC close to VCC(off) with a 10 kW resistor to GND
VDRVhigh
DRV pin level at VCC = 35 V (RL = 33 kW, CL = 220 pF)
REGULATION BLOCK
VREF
Feedback Voltage Reference:
@ 25°C
Over the temperature range
IEA Error Amplifier Current Capability
GEA Error Amplifier Gain
VCONTROL
VCONTROL Pin Voltage:
−VCONTROLMAX − @ VFB = 2 V
−VCONTROLMIN
− @ VFB = 3 V
VOUTL/VREF Ratio (VOUT Low Detect Threshold/VREF) (guaranteed by design)
HOUTL/VREF Ratio (VOUT Low Detect Hysteresis/VREF) (guaranteed by design)
IBOOST
VCONTROL Pin Source Current when (VOUT Low Detect) is activated
CURRENT SENSE AND ZERO CURRENT DETECTION BLOCKS
VCS(th)
TLEB,OCP
TLEB,OVS
TOCP
VZCD(th)H
VZCD(th)L
VZCD(hyst)
RZCD/CS
VCL(pos)
IZCD(bias)
IZCD(bias)
TZCD
TSYNC
TWDG
TWDG(OS)
TTMO
IZCD(gnd)
STATIC OVP
Current Sense Voltage Reference
Over-current Protection Leading Edge Blanking Time (guaranteed by design)
“OverStress” Leading Edge Blanking Time (guaranteed by design)
Over-current Protection Delay from VCS/ZCD > VCS(th) to DRV low
(dVCS/ZCD / dt = 10 V/ms)
Zero Current Detection, VCS/ZCD rising
Zero Current Detection, VCS/ZCD falling
Hysteresis of the Zero Current Detection Comparator
VZCD(th)H over VCS(th) Ratio
CS/ZCD Positive Clamp @ ICS/ZCD = 5 mA
Current Sourced by the CS/ZCD Pin, VCS/ZCD = VZCD(th)H
Current Sourced by the CS/ZCD Pin, VCS/ZCD = VZCD(th)L
(VCS/ZCD < VZCD(th)L) to (DRV high)
Minimum ZCD Pulse Width
Watch Dog Timer
Watch Dog Timer in “Overstress” Situation
Time-out Timer
Source Current for CS/ZCD pin impedance Testing
DMIN
Duty Cycle, VFB = 3 V, Vcontrol pin open
ON-TIME CONTROL
TON(LL)
TON(LL)2
TON(HL)
TON(LL)(MIN)
TON(HL)(MIN)
Maximum On Time, Vsense = 1.4 V and Vcontrol maximum (CrM)
On Time, Vsense = 1.4 V and Vcontrol = 2.5 V (CrM)
Maximum On Time, Vsense = 2.8 V and Vcontrol maximum (CrM)
Minimum On Time, Vsense = 1.4 V (not tested, guaranteed by characterization)
Minimum On Time, Vsense = 2.8 V (not tested, guaranteed by characterization)
Min
8.0
10
2.44
2.42
−
110
−
−
95.0
−
180
450
100
50
−
675
200
375
1.4
−
0.5
0.5
−
−
80
400
20
−
−
22.0
10.5
7.3
−
−
Typ
−
12
2.50
2.50
±20
220
4.5
0.5
95.5
−
220
500
200
100
40
750
250
500
1.5
15.6
−
−
60
110
200
800
30
250
−
25.0
12.5
8.5
−
−
Max
−
14
2.54
2.54
−
290
−
−
96.0
0.5
250
550
350
170
200
825
300
−
1.6
−
2.0
2.0
200
200
320
1200
50
−
0
29.0
14.0
9.6
200
100
Unit
V
V
V
mA
mS
V
%
%
mA
mV
ns
ns
ns
mV
mV
mV
−
V
mA
mA
ns
ns
ms
ms
ms
mA
%
ms
ms
ms
ns
ns
www.onsemi.com
6
6 Page NCP1612A, NCP1612B, NCP1612A1, NCP1612A2, NCP1612A3, NCP1612B2
TYPICAL CHARACTERISTICS
300
275
250
225
200
175
150
125
100
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 10. FFcontrol Pin Current, VSENSE =
1.4 V and VCONTROL Maximum vs. Temperature
22.5
200
175
150
125
100
75
50
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. FFcontrol Pin Current, VSENSE =
2.8 V and VCONTROL Maximum vs. Temperature
40
20.5 39
18.5 38
16.5 37
14.5
12.5
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 12. Dead-time, VFFcontrol = 1.75 V vs.
Temperature
0.85
36
35
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Dead-time, VFFcontrol = 1.00 V vs.
Temperature
0.85
0.75 0.75
0.65 0.65
0.55 0.55
0.45
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. FFcontrol Pin Skip Level (VFFcontrol
Rising) vs. Temperature
0.45
−50 −30 −10 10 30 50 70 90 110 130
TJ, JUNCTION TEMPERATURE (°C)
Figure 15. FFcontrol Pin Skip Level (VFFcontrol
Falling) vs. Temperature
www.onsemi.com
12
12 Page | ||
Seiten | Gesamt 30 Seiten | |
PDF Download | [ NCP1612B Schematic.PDF ] |
Teilenummer | Beschreibung | Hersteller |
NCP1612A | High-Efficiency Power Factor Controller | ON Semiconductor |
NCP1612A1 | High-Efficiency Power Factor Controller | ON Semiconductor |
NCP1612A2 | High-Efficiency Power Factor Controller | ON Semiconductor |
NCP1612A3 | High-Efficiency Power Factor Controller | ON Semiconductor |
NCP1612B | High-Efficiency Power Factor Controller | ON Semiconductor |
Teilenummer | Beschreibung | Hersteller |
CD40175BC | Hex D-Type Flip-Flop / Quad D-Type Flip-Flop. |
Fairchild Semiconductor |
KTD1146 | EPITAXIAL PLANAR NPN TRANSISTOR. |
KEC |
www.Datenblatt-PDF.com | 2020 | Kontakt | Suche |