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VIB0010TFJ Schematic ( PDF Datasheet ) - VICOR Corporation

Teilenummer VIB0010TFJ
Beschreibung Bus Converter
Hersteller VICOR Corporation
Logo VICOR Corporation Logo 




Gesamt 16 Seiten
VIB0010TFJ Datasheet, Funktion
VIB0010TFJ
BCMTM
DC to DC
Bus Converter Module
PRELIMINARY DATASHEET
S
C NRTL US
FEATURES
352 Vdc – 12.5 Vdc 300 W Bus Converter Module
High efficiency (>95%) reduces system power
consumption
High power density (>1000 W/in3)
reduces power system footprint by >40%
“Full Chip” VI Chip package enables surface mount,
low impedance interconnect to system board
Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
Provides enable/disable control, internal temperature
monitoring
ZVS/ZCS Resonant Sine Amplitude Converter topology
Can be paralleled to create multi-kW arrays
TYPICAL APPLICATIONS
High End Computing Systems
Automated Test Equipment
High Density Power Supplies
DESCRIPTION
The VI Chip Bus Converter Module is a high efficiency (>95%)
Sine Amplitude Converter (SAC)TM operating from a 330 to 365
Vdc primary bus to deliver an isolated 11.79 – 13.04 V nominal,
unregulated secondary. The SAC offers a low AC impedance
beyond the bandwidth of most downstream regulators, mean-
ing that input capacitance normally located at the input of a
regulator can be located at the input to the SAC. Since the K
factor of the VIB0010TFJ is 1/28, that capacitance value can be
reduced by a factor of 784x, resulting in savings of board area,
materials and total system cost.
The VIB0010TFJ is provided in a VI Chip package compatible
with standard pick-and-place and surface mount assembly
processes. The VI Chip package provides flexible thermal
management through its low junction-to-case and junction-to-
board thermal resistance. With high conversion efficiency the
VIB0010TFJ increases overall system efficiency and lowers
operating costs compared to conventional approaches.
VIN = 330 – 365 V
POUT = 300 W(NOM)
VOUT = 11.79 – 13.04 V (NO LOAD) K = 1/28
TYPICAL APPLICATION
enable / disable
switch
SW1
F1
VIN
C1 1 µF
PC
TM
BCM
+In +Out
-In -Out
VOUT
POL
POL
POL
POL (8)
v i c o r p o w e r. c o m
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.1
9/2009
Page 1 of 16






VIB0010TFJ Datasheet, Funktion
VIB0010TFJ
PRELIMINARY DATASHEET
No Load Power Dissipation
12
10
8
6
4
2
0
330 335 340 345 350 355
Input Voltage (V)
-40 25 100
Figure 1 – No load power dissipation vs. VIN; TCASE
360
365
Full Load Efficiency vs. Temperature
96.0
95.5
95.0
94.5
94.0
93.5
93.0
-40
-20 0
20 40 60
Case Temperature (°C)
330 352 365
80
Figure 2 – Full load efficiency vs. temperature; VIN
100
Efficiency & Power Dissipation -40°C Case
98 21
94 η
90
86
82
78
74
70
66
PD
19
17
15
13
11
9
62
0
330
5 10 15 20
Output Load (A)
352 365 330
7
25 30
352 365
Figure 3 – Efficiency and power dissipation at -40°C (case); VIN
Efficiency & Power Dissipation 25°C Case
98 19
96
94 η
92
17
15
90
88
86
PD
13
11
84 9
82
7
80
78 5
0
5
10 15 20
25 30
Output Load (A)
330 352 365 330 352 365
Figure 4 – Efficiency and power dissipation at 25°C (case); VIN
Efficiency & Power Dissipation 100°C Case
98 21
96
94 η
92
90
19
17
15
88
86
84
PD
82
80
13
11
9
7
78 5
0 5 10 15 20 25 30
Output Load (A)
330 352 365 330
352 365
Figure 5 – Efficiency and power dissipation at 100°C (case); VIN
18
17
16
15
14
13
12
11
10
9
8
-40
Rout vs. Case Temperature
-20 0 20 40 60 80
Temperature (°C)
2.6 A
26 A
Figure 6 – ROUT vs. temperature vs. IOUT
100
v i c o r p o w e r. c o m
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.1
9/2009
Page 6 of 16

6 Page









VIB0010TFJ pdf, datenblatt
VIB0010TFJ
PRELIMINARY DATASHEET
5.0 USING THE CONTROL SIGNALS TM AND PC
The PC control pin can be used to accomplish the following
functions:
Delayed start: At start-up, PC pin will source a constant
100 uA current to the internal RC network. Adding an
external capacitor will allow further delay in reaching the
2.5 V threshold for module start.
Synchronized start up: In a parallel module array, PC pins
shall be connected in order to ensure synchronous start of all
the units. While every controller has a calibrated 2.5 V
reference on PC comparator, many factors might cause
different timing in turning on the 100 uA current source on
each module, i.e.:
– Different VIN slew rate
– Statistical component value distribution
By connecting all PC pins, the charging transient will be
shared and all the modules will be enabled synchronously.
Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM PC provides a
regulated 5 V, 2 mA voltage source.
Output Disable: PC pin can be actively pulled down in order
to disable module operations. Pull down impedance shall be
lower than 400 Ω and toggle rate lower than 1 Hz.
Fault detection flag: The PC 5 V voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and PC voltage is
re-enabled. For system monitoring purposes (microcontroller
interface) faults are detected on falling edges of PC signal.
It is important to notice that PC doesn’t have current sink
capability (only 150 kΩ typical pull down is present),
therefore, in an array, PC line will not be capable of disabling
all the modules if a fault occurs on one of them.
6.0 FUSE SELECTION
VI Chips are not internally fused in order to provide flexibility
in configuring power systems. Input line fusing of VI Chips is
recommended at system level, in order to provide thermal
protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
• Current rating (usually greater than maximum BCM current)
• Maximum voltage rating (usually greater than the maximum
possible input voltage)
• Ambient temperature
• Nominal melting I2t
• Recommended fuse: 2.5 A Bussmann PC-Tron or
SOC type 36CFA.
The temperature monitor (TM) pin provides a voltage propor-
tional to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by x100. (i.e. 3.0 V = 300 K = 27ºC). It is important to
remember that VI chips are multi-chip modules, whose
temperature distribution greatly vary for each part number as
well with input/output conditions, thermal management and
environmental conditions. Therefore, TM cannot be used to
thermally protect the system.
Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and TM voltage is
re-enabled.
v i c o r p o w e r. c o m
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.1
9/2009
Page 12 of 16

12 Page





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