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FSB50760SFS Schematic ( PDF Datasheet ) - Fairchild Semiconductor

Teilenummer FSB50760SFS
Beschreibung Motion SPM 5 module
Hersteller Fairchild Semiconductor
Logo Fairchild Semiconductor Logo 




Gesamt 10 Seiten
FSB50760SFS Datasheet, Funktion
FSB50760SFS
Motion SPM® 5 SuperFET® Series
Aug 2015
Features
• UL Certified No. E209204 (UL1557)
• 600 V RDS(on) = 530 mMaxSuperFET MOSFET 3-
Phase Inverter with Gate Drivers and Protection
• Built-in Bootstrap Diodes Simplify PCB Layout
• Separate Open-Source Pins from Low-Side MOS-
FETS for Three-Phase Current-Sensing
• Active-HIGH Interface, Works with 3.3 / 5 V Logic,
Schmitt-trigger Input
• Optimized for Low Electromagnetic Interference
• HVIC Temperature-Sensing Built-in for Temperature
Monitoring
• HVIC for Gate Driving and Under-Voltage Protection
• Isolation Rating: 1500 Vrms / 1 min.
• Moisture Sensitive Level (MSL) 3
• RoHS Compliant
Applications
• 3-Phase Inverter Driver for Small Power AC Motor
Drives
Related Source
RD-402 - Reference Design for Motion SPM 5 Super-
FET Series
• AN-9082 - Motion SPM5 Series Thermal Performance
by Contact Pressure
• AN-9080 - User’s Guide for Motion SPM 5 Series V2
General Description
The FSB50760SFS is an advanced Motion SPM® 5
module providing a fully-featured, high-performance
inverter output stage for AC Induction, BLDC and PMSM
motors such as refrigerators, fans and pumps. These
modules integrate optimized gate drive of the built-in
MOSFETs(SuperFET® technology) to minimize EMI and
losses, while also providing multiple on-module
protection features including under-voltage lockouts and
thermal monitoring. The built-in high-speed
HVIC requires only a single supply voltage and
translates the incoming logic-level gate inputs to the
high-voltage, high-current drive signals required to
properly drive the module's internal MOSFETs.
Separate open-source MOSFET terminals are available
for each phase to support the widest variety of control
algorithms.
3D Package Drawing (Click to Activate 3D Content)
Package Marking & Ordering Information
Device Marking
50760SFS
Device
FSB50760SFS
Package
SPM5Q-023
Reel Size
330mm
Packing Type
Tape-Reel
Quantity
450
©2012 Fairchild Semiconductor Corporation
FSB50760SFS Rev. 1.1
1
www.fairchildsemi.com






FSB50760SFS Datasheet, Funktion
These values depend on PWM control algorithm
+15 V
C1 * Example Circuit : V phase
10 F
R5
C5
VCC
HIN
LIN
COM
VTS
VB
HO
VS
LO
VDC
P
HIN LIN Output
Note
Inverter
V Output
00
01
Z Both FRFET Off
0 Low side FRFET On
C3
10
VDC High side FRFET On
1
1 Forbidden
Shoot through
N R3
Open Open
Z
Same as (0,0)
C2 C4
One Leg Diagram of Motion SPM® 5 Product
* Example of Bootstrap Param: ters
C1= C2 = 1 F Ceramic Capacitor
Figure 3. Recommended MCU Interface and Bootstrap Circuit with Parameters
3rd Notes:
1. Parameters for bootstrap circuit elements are dependent on PWM algorithm. For 15 kHz of switching frequency, typical example of parameters is shown above.
2. RC-coupling (R5 and C5) and C4 at each input of Motion SPM 5 product and MCU (Indicated as Dotted Lines) may be used to prevent improper signal due to surge-noise.
3. Bold lines should be short and thick in PCB pattern to have small stray inductance of circuit, which results in the reduction of surge-voltage. Bypass capacitors such as C1, C2
and C3 should have good high-frequency characteristics to absorb high-frequency ripple-current.
Figure 4. Case Temperature Measurement
3rd Notes:
4. Attach the thermocouple on top of the heat-sink of SPM 5 package (between SPM 5 package and heatsink if applied) to get the correct temperature measurement.
3.5
3.0
2.5
2.0
1.5
1.0
0.5
20 40 60 80 100 120 140 160
THVIC [oC]
Figure 5. Temperature Profile of VTS (Typical)
©2012 Fairchild Semiconductor Corporation
FSB50760SFS Rev. 1.1
6
www.fairchildsemi.com

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